Integrated Camera Module Substrate Design for ToF RGB Alignment
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Solution Overview
Problem
Current 3D camera modules, particularly those using Time-of-Flight (ToF) technology, face issues with noise and distortion in depth information, leading to decreased accuracy and increased manufacturing costs and size due to the need for separate PCBs for ToF and RGB modules.
Innovation Solution
A camera module design that integrates a light source element, ToF sensor, and RGB module onto a single Printed Circuit Board (PCB) with a flexible connection, allowing for reduced size, aligned optical axes, and simplified manufacturing by eliminating the need for separate PCBs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a separate PCB is mounted on an RGB module to allow it to be disposed near a ToF sensor, then depth image accuracy is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the ToF sensor and RGB sensor onto a single integrated substrate, eliminating the need for separate PCBs and complex mounting structures. This merging approach maintains the spatial proximity required for accurate depth imaging while simplifying the overall device architecture and reducing manufacturing complexity.
Solution Approach 2:
The integrated substrate serves multiple functions simultaneously: it acts as the mounting platform for both ToF and RGB sensors, provides electrical connections for both sensor types, and enables precise spatial alignment between the two sensor arrays. This multi-functional design reduces the number of separate components needed.
2Measurement precision
If a separate PCB is mounted on an RGB module to allow it to be disposed near a ToF sensor, then depth image accuracy is improved, but manufacturing cost increases
Solution Approach 1:
By merging the ToF and RGB sensors onto a single substrate, the patent eliminates the need for separate PCB fabrication, mounting hardware, and assembly steps. This consolidation reduces material costs and manufacturing complexity while maintaining the spatial relationship necessary for accurate depth imaging.
3Ease of manufacture
If ToF sensor and RGB module are disposed separately on different PCBs, then manufacturing process is simplified, but camera module size and volume increase
Solution Approach 1:
The patent merges previously separate ToF and RGB sensor assemblies onto a single integrated substrate, significantly reducing the overall camera module volume. This consolidation maintains manufacturing simplicity by using a unified mounting platform while eliminating the space required for separate PCBs and their interconnections.
4Reliability
If multiple separate components are used for ToF and RGB sensors, then component reliability is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple sensor components onto a single substrate structure, reducing the number of separate parts that need to be assembled and connected. This merger maintains component reliability by providing stable mounting for each sensor while reducing structural complexity and the potential failure points associated with multiple separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design minimizes the camera module's size and volume, reduces manufacturing costs, and enables high-resolution imaging by aligning optical axes, thereby improving depth image accuracy and reducing manufacturing complexity.
Implementation Method 1
a flexible substrate disposed between the first surface and the second surface of the substrate
Data Source
AI summary
A camera module including a substrate having a first region, a second region disposed upper than the first region, and a first connection part connecting the first region and the second region; a lens unit disposed on the first region of the substrate and including a lens; a heat sink part disposed on the first region of the substrate; and a light source element disposed on the second region of the substrate. The heat sink part is disposed between the first region of the substrate and the second region of the substrate in an optical axis direction of the light source element.