Camera Module Thermal Management via Substrate Holes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Camera modules mounted on vehicles face issues with heat generation and temperature/humidity variations, leading to deteriorated image quality and performance.
Innovation Solution
A camera module design featuring a substrate with a heat transfer portion containing penetrating holes filled with metal heat transfer material, coupled with a thermoelectric element and heat dissipation plate, to manage temperature and humidity effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If an image sensor with higher resolution is applied, then image quality is improved, but heat generation increases causing image quality deterioration
Solution Approach 1:
The substrate is divided into multiple regions including a heat transfer portion with penetrating holes filled with heat transfer material. This segmentation allows localized heat management around the image sensor while maintaining overall structural integrity and optical performance.
Solution Approach 2:
A thermoelectric element is introduced as an intermediary component between the image sensor and the external environment. This mediator actively transfers heat from the image sensor to surrounding areas, preventing heat accumulation while preserving the high-resolution imaging capability.
2Adaptability or versatility
If the camera module is mounted outside the vehicle, then the camera can capture external objects, but temperature and humidity directly affect camera performance
Solution Approach 1:
The camera module incorporates a heat transfer portion with penetrating holes filled with heat transfer material specifically at the location where heat accumulation occurs. This localized approach allows the module to maintain external mounting versatility while providing targeted thermal management to protect performance stability from environmental temperature and humidity variations.
3Temperature
If heat dissipation structures are added to the camera module, then temperature control is improved, but device complexity increases
Solution Approach 1:
The heat transfer portion is merged with the substrate structure, and the thermoelectric element is integrated into the existing module architecture. This combining approach achieves effective temperature control while minimizing additional complexity by utilizing and integrating with existing structural elements rather than adding completely separate systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains appropriate temperature and humidity levels within the camera module, enhancing image quality and performance by efficiently managing heat and environmental conditions.
Implementation Method 1
a heat transfer member, comprising a thermoelectric element, and disposed on a second surface of the substrate, wherein a lens module is disposed in the inner housing, wherein the substrate includes a heat transfer portion, wherein the heat transfer portion comprises a plurality of holes which penetrate the substrate, and wherein a heat transfer material is disposed in the plurality of holes
Implementation Method 2
a heat transfer member, comprising a thermoelectric element
Data Source
AI summary
A camera module is provided. The lens module includes a substrate on which an image sensor is disposed; a lens module, disposed in an inner housing of the camera module, and further disposed on a first surface of the substrate; and a heat transfer member, including a thermoelectric element, and disposed on a second surface of the substrate, wherein the substrate includes a heat transfer portion, wherein the heat transfer portion includes a plurality of holes which penetrate the substrate, and wherein a heat transfer material is disposed in the plurality of holes.