Camera Module Heat Dissipation via Support Member Segmentation
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Solution Overview
Problem
Dual-camera modules in electronic devices generate excessive heat, which can degrade camera performance due to inadequate heat dissipation, especially when the camera module is positioned on a heat dissipation path that spreads heat from other components like the Application Processor or Power Management Integrated Circuit.
Innovation Solution
The camera module is designed with a gap along its periphery when inserted into an opening in the support member, preventing direct heat transfer from the support member and allowing for effective heat dissipation through a flexible thermal conductor that connects to the support member, thereby blocking heat from other components and ensuring the camera module's heat is dissipated efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the camera module is disposed in the support member on the heat dissipation path from the AP or PMIC, then the heat from the AP or PMIC can be dissipated effectively, but the spreading heat can be transferred to the camera module and degrade its performance
Solution Approach 1:
The support member is segmented by forming a through-hole that passes through it, creating distinct regions: a first region for heat dissipation and a second region for camera module installation. This segmentation allows the heat dissipation path to be separated from the camera module location, enabling effective heat dissipation from the AP or PMIC while preventing heat transfer to the camera module.
Solution Approach 2:
The harmful heat transfer path is extracted by creating a through-hole in the support member. The through-hole removes the continuous thermal conduction path between the heat dissipation region and the camera module region, thereby extracting the harmful thermal coupling while preserving the structural integrity of the support member.
2Volume of moving object
If the camera module is disposed near the heat component, then the device structure can be compact, but the heat from the heat component can degrade the camera module performance
Solution Approach 1:
The support member is designed with localized structural modifications: a through-hole is formed at a specific location to create a heat-free zone for the camera module, while other regions maintain their heat dissipation function. This local quality change allows the camera module to be positioned near heat components without compromising its performance, as the through-hole creates a thermal barrier in the immediate vicinity of the camera module.
3Loss of energy
If the support member provides a wide heat dissipation area, then the heat from the AP or PMIC can be quickly emitted, but the camera module cannot be properly supported if a through-hole is formed
Solution Approach 1:
The support member is segmented by forming a through-hole, creating distinct functional regions. The first region maintains the wide heat dissipation area for quick heat emission from the AP or PMIC, while the second region provides structural support for the camera module. The segmentation allows both heat dissipation efficiency and mechanical support strength to be optimized in their respective regions.
Solution Approach 2:
The through-hole acts as an intermediary structure that separates the heat dissipation function from the camera module support function. It allows heat to be efficiently dissipated in the first region while providing a stable mounting location for the camera module in the second region, mediating between the conflicting requirements of heat emission and structural support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This heat dissipation structure effectively prevents performance degradation of the camera module by blocking heat from other components and ensures efficient heat transfer from the camera module to the support member, maintaining camera performance while maintaining a slim device thickness and aesthetic appeal.
Implementation Method 1
The camera module is disposed to contact the support member at a specific region to prevent and/or reduce the heat of the camera module from spreading to other components of the electronic device
Implementation Method 2
The support member comprises a first opening to which the camera module is inserted and disposed with a gap along a periphery of the camera module
Data Source
AI summary
An electronic device according to various embodiments of the present disclosure can include at least one heat component, a camera module comprising a camera disposed near the at least one heat component, and a support comprising a first opening in which the camera module is inserted and disposed with a gap along at least a portion of a periphery of the camera module.