Camera Module Tapered Base UV Adhesive Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing camera modules face challenges in securing high durability and proper optic axis alignment due to adhesive issues, such as adhesive flow and contamination of internal components, especially in compact designs where UV-hardened adhesives are difficult to scan and thermosetting adhesives require heat treatment, denaturing sensitive materials and increasing costs.
Innovation Solution
A camera module design featuring a thread-free engaging method between the lens unit and actuator unit, using a UV-hardened adhesive initially followed by thermosetting epoxy, with a tapered configuration to facilitate UV scanning and a recessed structure to prevent adhesive overflow, along with strength reinforcing grooves to enhance adhesive engagement and prevent contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If UV-hardened adhesive is used in compact camera module, then adhesive hardening is achieved, but UV scanning is difficult due to compact size and small adhesive application area
Solution Approach 1:
The patent introduces a tapered configuration that creates a dimensional gradient in the adhesive layer thickness. The adhesive layer transitions from thicker at the periphery to thinner at the center, creating a thickness gradient that facilitates UV light penetration and scanning throughout the entire adhesive area, solving the problem of insufficient UV penetration in compact modules.
Solution Approach 2:
The patent applies different adhesive layer thicknesses at different locations within the adhesive bonding area. The tapered configuration creates local variations in adhesive thickness, with the peripheral regions having greater thickness than the central region, optimizing both structural strength and UV hardening effectiveness in different areas.
2Strength
If thermosetting adhesive is used, then adhesive bonding strength is achieved, but heat treatment denatures materials and increases cost
Solution Approach 1:
The patent replaces the thermal field (heat treatment) with an optical field (UV irradiation) for adhesive hardening. By using UV-hardened adhesive that cures through photopolymerization upon UV exposure, the process eliminates the need for high-temperature oven treatment, thereby preventing heat-induced denaturation of sensitive materials while achieving sufficient bonding strength.
Solution Approach 2:
The patent changes the curing mechanism parameter from thermal activation to optical activation. Instead of using thermosetting adhesive that requires heat treatment for crosslinking, the patent employs UV-hardened adhesive that undergoes polymerization through UV light exposure, fundamentally changing the activation parameter from temperature to light wavelength and intensity.
3Strength
If adhesive is applied to fix cover can and base, then bonding is achieved, but adhesive may flow inside cover can and contaminate internal components
Solution Approach 1:
The patent incorporates a recessed configuration in the base structure that creates a physical barrier and containment zone for the adhesive. This preliminary structural design prevents adhesive from flowing into the cover can and contaminating internal components by providing a dedicated recessed area that confines the adhesive to the bonding interface region.
Solution Approach 2:
The recessed configuration acts as an intermediary structure between the adhesive and the internal components of the cover can. This intermediate geometric feature serves as a buffer zone that captures and contains the adhesive, preventing direct contact between the adhesive and sensitive internal components while still allowing effective bonding to occur.
4Productivity
If smaller adhesive area is used, then productivity is improved, but adhesive flow control becomes more difficult
Solution Approach 1:
The patent creates non-uniform adhesive layer thickness through the tapered configuration, with different regions having optimized thickness values. The peripheral regions have greater thickness for controlled flow and containment, while the central region has reduced thickness for precise bonding, allowing effective adhesive management in a compact area that maintains high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves better optic axis alignment, improves product reliability and durability by ensuring effective adhesive hardening and preventing adhesive contamination, thus enhancing the overall quality and productivity of the camera module.
Implementation Method 1
When the UV-hardened adhesive is used, it is difficult to properly scan for hardening the adhesive due to the compact size of the camera module
Implementation Method 2
In case that the thermosetting adhesive is used, the camera module is thermally treated in the oven
Data Source
AI summary
A camera module generally provided in a mobile terminal. The camera module includes a lens unit which is configured to accommodate at least one lens. An actuator unit is configured to fix the lens unit, and a base which is fixed by an adhesive to the bottom of the actuator. A printed circuit board (PCB) to which the base is fixed for thereby supplying electric power to the actuator unit. Either a corner of an outer side of the bottom of the actuator unit or a corner of an outer side of the top of the base is tapered.