Bi-directional Camera Module Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional bi-directional camera modules in flip chip bonders are heated by the substrate heater, leading to misalignment of flip chips with respect to the substrate, which affects production yield.
Innovation Solution
A bi-directional camera module design with a housing that includes air inlets and outlets for air circulation, a temperature sensor, and an air circulator to maintain a constant temperature or desired temperature range, preventing thermal expansion and misalignment by controlling the temperature of the lenses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the substrate heater is used to heat the substrate, then the substrate temperature is increased for proper bonding, but the camera module is heated causing misalignment of the flip chip
Solution Approach 1:
The camera module is physically separated from the heated substrate area by being mounted on the bonding head, which moves independently. The housing encloses the camera components to isolate them thermally from the substrate heater, allowing the substrate to be heated without affecting camera temperature and alignment precision
Solution Approach 2:
The bonding head serves as an intermediary carrier that holds the camera module and positions it over the substrate. This intermediary structure allows the camera to observe the substrate-heating process without being directly heated itself, resolving the thermal conflict between substrate heating and camera temperature stability
2Measurement precision
If the camera module is positioned close to the substrate for accurate imaging, then image quality is improved, but the camera module is more susceptible to heat from the substrate heater
Solution Approach 1:
The camera module is segmented into enclosed components (sensors, lenses, housing) that are thermally isolated from each other and from the substrate heater. The housing acts as a thermal barrier, allowing the camera to be positioned close to the substrate for accurate imaging while protecting internal components from excessive heat
Solution Approach 2:
Different parts of the camera module have different thermal characteristics - the housing and mounting structure are designed to withstand heat, while the sensitive sensor and lens components are protected within the housing. This local differentiation allows close positioning for image quality while maintaining component temperature within acceptable ranges
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains the temperature of the camera module, reducing misalignment between the flip chip and substrate, thereby improving production yield and ensuring accurate alignment.
Implementation Method 1
preventing thermal expansion and misalignment by controlling the temperature of the lenses
Implementation Method 2
a housing that includes air inlets and outlets for air circulation
Data Source
AI summary
Bi-directional camera modules and flip chip bonders including the same are provided. The module includes a circuit board on which an upper sensor and a lower sensor are mounted, an upper lens and a lower lens disposed on the upper sensor and under the lower sensor, respectively, and a housing fixing the upper lens and the lower lens spaced apart from the upper sensor and the lower sensor, respectively. The housing surrounds the circuit board. The housing has a plurality of inlets and an outlet through which air flows, and the housing has an air passage connected from the inlets to the outlet via a space between lower lens and the lower sensor.