Camera Module Stack Structure for ISP Processor Heat Dissipation
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Solution Overview
Problem
Conventional camera modules face challenges with heat dissipation due to increased heat generation from substrates and elements, leading to potential malfunctions and shutdowns, as they rely primarily on natural convection for cooling, especially when the ISP processor is positioned on a second stacked substrate.
Innovation Solution
The camera module redesigns the assembly stack structure by positioning the processor closer to a metal body and incorporating a heat dissipation pad made of a thermally conductive material, with a longer fourth substrate overlapping the second substrate to enhance thermal conductivity and facilitate heat transfer to the metal body for external dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the ISP processor is positioned on the second stacked substrate to increase processing capability, then the computational performance is improved, but the heat dissipation becomes insufficient leading to overheating and potential malfunction
Solution Approach 1:
A heat dissipation pad made of thermally conductive material is introduced as an intermediary component between the ISP processor and the metal body. This pad facilitates efficient heat transfer from the processor to the metal body, resolving the heat dissipation issue while maintaining the processor's position on the second stacked substrate for optimal computational performance.
Solution Approach 2:
The heat dissipation function is extracted and dedicated to a separate heat dissipation pad component, allowing the processor to be positioned optimally for computation while the pad handles the thermal management function independently, transferring heat to the metal body for external dissipation.
2Device complexity
If only natural heat dissipation is used to simplify the structure, then the device complexity is reduced, but the reliability decreases due to overheating causing sudden shutdowns
Solution Approach 1:
The heat dissipation pad serves as a simple intermediary structure that enhances natural heat dissipation without requiring complex active cooling systems. It provides reliable thermal management through its thermal conductivity, preventing overheating-induced shutdowns while maintaining structural simplicity.
Solution Approach 2:
The thermal conductivity parameter of the heat dissipation pad is optimized to enhance heat transfer efficiency. By changing the material properties and thermal parameters of the pad, the system achieves reliable heat dissipation through natural convection without adding structural complexity.
3Measurement precision
If the number of substrates and elements is increased to achieve high-resolution images, then the image quality is improved, but the heat generation increases making heat dissipation more difficult
Solution Approach 1:
The heat dissipation pad acts as a mediator that collects and transfers heat from multiple substrates and elements to the metal body. This allows the system to accommodate increased numbers of substrates and elements for high-resolution imaging while managing the resulting heat generation through efficient thermal conduction to the metal body for external dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This redesign improves heat dissipation performance by effectively transferring heat generated by the processor to the metal body, preventing overheating and potential malfunctions, ensuring stable operation of the camera module.
Implementation Method 1
incorporating a heat dissipation pad made of a thermally conductive material... effectively transferring heat generated by the processor to the metal body
Data Source
AI summary
A camera module including a first body having a lens, a second body coupled to the first body, a substrate assembly disposed inside the second body and including a plurality of substrates, and a support member disposed between two of the plurality of substrates. The support member includes a fence portion disposed between the two of the plurality of substrates, and a hook portion extending from the fence portion and having a coupling hole into which a portion of a side surface of an upper substrate of the two of the plurality of substrates is inserted. The support member includes a plurality of support members. One of the plurality of support members has two hooks which face each other, and at least a portion of one of two hooks is not overlapped with the other of two hooks in a first direction perpendicular to an optical axis direction.