Vehicular Camera Module Two-Shot Overmolding Integration
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Solution Overview
Problem
Existing vehicle vision systems face challenges in compact design, reduced component count, and cost-effective manufacturing while maintaining scalable architecture and adaptability for various applications, with current technologies often requiring complex assembly processes and higher risks of moisture and tin whisker issues.
Innovation Solution
A two-shot overmolding process is employed, using low-pressure molding for the circuit board and high-pressure injection molding for the outer shell, which includes a connector portion, allowing for various electrical connectors and optional electrical shielding, and enabling adjustable focus through positioning the imager relative to the lens.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a two-shot overmolding process is used to integrate the circuit board and outer shell, then manufacturing time is reduced and packaging tolerances are minimized, but the device complexity increases due to the multi-step molding process
Solution Approach 1:
The patent combines the circuit board and outer shell into a single integrated component through two-shot overmolding. The first shot forms the circuit board with connector terminals, and the second shot forms the outer shell with connector housing, merging previously separate components into one unified structure that reduces assembly steps and manufacturing time.
Solution Approach 2:
The circuit board is pre-formed with connector terminals protruding through the outer shell before the final assembly. This preliminary formation of the circuit board structure with integrated connectors allows for precise positioning and reduces packaging tolerances in subsequent assembly steps.
2Ease of manufacture
If the connector portion is molded at and partially around the connector element, then the connector integration is simplified and manufacturing is more efficient, but the manufacturing precision requirements increase to ensure proper connector alignment
Solution Approach 1:
Connector elements are pre-positioned and secured to the circuit board before the outer shell molding process. This preliminary placement ensures proper alignment and positioning, allowing the outer shell to be molded around predetermined locations with accurate connector terminal exposure.
Solution Approach 2:
The outer shell acts as an intermediary structure that houses and positions the connector elements. By molding the outer shell around pre-positioned connectors, the system achieves both ease of manufacture and proper alignment, as the shell provides mechanical support and precise positioning features.
3Volume of moving object
If the camera module is designed for compact size with reduced component count, then the packaging volume is reduced and cost is decreased, but the adaptability for various electrical connectors is reduced
Solution Approach 1:
The outer shell is designed as a universal housing structure that can accommodate different types of electrical connectors (coaxial, multi-pin, etc.) through standardized mounting features and terminal exposure configurations. This multi-functional design allows a single camera module platform to support various connector types without increasing overall volume.
Solution Approach 2:
The connector portion is segmented as a separate moldable feature within the outer shell, allowing different connector configurations to be produced from the same base structure. This segmentation enables adaptability for various connector types while maintaining a compact integrated design.
4Ease of manufacture
If low-pressure molding is used for the circuit board and high-pressure injection molding for the outer shell, then the manufacturing process is optimized for each component, but the device complexity increases due to varying molding processes
Solution Approach 1:
The patent merges two different molding processes (low-pressure for circuit board, high-pressure for outer shell) into a single integrated two-shot overmolding operation. The first shot uses low-pressure molding to form the circuit board with connector terminals, and the second shot uses high-pressure injection molding to form the outer shell around the circuit board, combining previously separate processes into one synchronized operation.
Data Source
AI summary
A method of forming a vehicular camera module includes providing an imager circuit board, a connector circuit board and a lens holder for holding a lens assembly. A lens holder and imager circuit board and connector circuit board construction is placed in a first mold and datumed in the first mold by a portion of the lens holder. An inner molded construction is formed by molding an inner molding over the circuit boards and a portion of the lens holder. The inner molded construction is placed in a second mold and datumed in the second mold by the portion of the lens holder. An outer molded construction is formed by molding an outer molding over the inner molding and over another portion of the lens holder. The outer molded construction may include a connector portion that is configured to connect to a connector end of a vehicular wire harness.