Camera Module Venting Structure for Focal Distance Stability

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Solution Overview

Problem

The focal distance between a lens and an image sensor in a camera module can deviate from the design range during assembly, leading to deformation or damage of elements, which results in malfunction.

Innovation Solution

A camera module structure with a printed circuit board coupled to an image sensor, an adhesive element exposed to a second space, and openings in the adhesive and printed circuit board to allow air expansion during curing, preventing focal distance deviation and element damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If adhesive element is used to bond holder and printed circuit board, then assembly is simplified, but air expansion during curing can cause focal distance deviation and element damage

Engineering Contradiction:
Improveassembly simplicityVSAvoidfocal distance stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent divides the bonding structure into multiple segments: the adhesive element is segmented into a first portion and a second portion, with the first portion forming an opening. This segmentation allows the adhesive to provide bonding function while the opening provides pressure relief function, resolving the contradiction between assembly simplicity and focal distance stability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The opening in the adhesive element acts as an intermediary structure that mediates between the bonding function and the pressure relief function. It allows air to escape during curing without compromising the adhesive bonding, thus maintaining both assembly simplicity and focal distance stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If complex etching or drilling processes are used to form venting paths, then pressure relief is improved, but manufacturing cost increases

Engineering Contradiction:
Improvepressure relief capabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the adhesive bonding function with the pressure relief function into a single integrated component. The adhesive element itself forms the opening, eliminating the need for separate venting paths created through complex etching or drilling processes. This reduces manufacturing cost while maintaining pressure relief capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The adhesive element is designed to perform multiple functions: bonding the holder to the printed circuit board and providing pressure relief through the opening. This multi-functionality eliminates the need for additional components or complex processes, reducing manufacturing cost while ensuring reliable pressure relief.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Strength

If adhesive element completely bonds holder and printed circuit board, then structural integrity is improved, but air trapped during curing causes element damage

Engineering Contradiction:
Improvebonding strengthVSAvoidair expansion damage
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The adhesive element is segmented into a first portion and a second portion, where the first portion forms an opening. This segmentation allows the adhesive to provide strong bonding through the second portion while the first portion with the opening allows air to escape, preventing air expansion damage.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent converts the potentially harmful effect of air expansion into a beneficial feature by designing the opening to allow controlled air escape. The air that would otherwise cause damage is now used to verify the opening functionality, and the controlled release prevents damage while maintaining bonding strength.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents changes in focal distance and damage to adhesive elements or printed circuit boards, ensuring accurate image acquisition without distortion.

Implementation Method 1

when air filling a first space expands while an adhesive element is heated for curing

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

when air filling a first space expands while an adhesive element is heated for curing

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentEP4488751B1Camera module
Publication Date: 2026.01.28 LG INNOTEK CO LTD
  • EP4488751B1 patent drawingFigure 1~2
  • EP4488751B1 patent drawingFigure 3~4
  • EP4488751B1 patent drawingFigure 5~6

AI summary

One embodiment of a camera module may comprise: a lens barrel provided with at least one lens; a holder to which the lens barrel is coupled; a printed circuit board coupled on the bottom of the holder to face the lens; an adhering portion coupling the holder and the printed circuit board; an opening portion opening a portion of a first space formed through the coupling of the printed circuit board and the holder; and a housing coupled with the holder, wherein a second space separated from the first space may be formed through the coupling of the holder and the housing, and the opening portion may communicate the first space with the second space.