Camera Objective Carrier Alignment via Magnetic Reference
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Solution Overview
Problem
Existing camera devices face challenges in maintaining chronologically stable optics and orientation between the objective and sensor chip, especially under thermal and mechanical strain, leading to image quality issues due to misalignment and scattered light from defective connections.
Innovation Solution
The camera design ensures stable optics by directly connecting the objective to the sensor chip, defining their situation and inclination through a unique contact surface, and using spacers and guide elements to maintain precise positioning, decoupling them from connection element behavior, and employing a light trap to minimize light interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive bonds are used to connect carrier and objective, then assembly is simplified, but connection stability deteriorates due to cracking from thermal expansions
Solution Approach 1:
The connection system is segmented into multiple independent connection elements distributed across the carrier surface, rather than relying on a single adhesive bond. This distributes thermal stress and prevents concentrated cracking, maintaining connection stability while allowing simplified assembly of multiple small components
Solution Approach 2:
The connection method transitions from chemical bonding (adhesive) to mechanical bonding (form-fit connections with connection elements). This parameter change eliminates the brittleness of adhesive bonds under thermal expansion while maintaining assembly simplicity through standardized mechanical interfaces
2Manufacturing precision
If complex parallel orientation is used to avoid tilt effects, then image quality is improved, but manufacturing precision requirements worsen due to extremely tight tolerances
Solution Approach 1:
The complex mechanical orientation system requiring precise parallel alignment is replaced by a field-based reference system using magnetic fields. The magnetic reference elements create invisible alignment fields that guide the objective carrier orientation without requiring mechanical precision, thereby improving ease of manufacture while maintaining high orientation precision
Solution Approach 2:
Magnetic reference elements serve as an intermediary between the carrier and objective carrier, mediating the orientation relationship. Instead of direct mechanical contact requiring tight tolerances, the magnetic field acts as a flexible intermediary that maintains precise orientation while accommodating manufacturing variations
3Reliability
If direct connection between objective and sensor chip is implemented, then orientation stability is improved, but device complexity increases due to additional positioning mechanisms
Solution Approach 1:
The objective carrier is designed with multi-functionality, serving both as the mounting structure for the objective and as the positioning reference system itself. The contact surface and magnetic reference elements are integrated into the carrier structure, eliminating the need for separate positioning mechanisms and reducing overall device complexity while maintaining orientation stability
Data Source
AI summary
An image acquisition device of a camera that has an electronic sensor chip, electrically connected to a circuit board, includes an objective situated in an objective carrier, and oriented in regard to situation and inclination in relation to an imager surface of the sensor chip. The situation and inclination of the objective are defined by a contact surface of the objective carrier. The contact surface of the objective carrier lies flat on the sensor chip, so that the imager surface is not covered by the contact surface.