Camera Module Semiconductor Package Layout for More Lead Balls
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Solution Overview
Problem
The challenge is to increase the number of lead balls on a semiconductor package while maintaining the minimum distance between pads, which is restricted by the decreasing overall height of the camera module and the limited space due to the increasing lens aperture and the need to accommodate a coil.
Innovation Solution
A semiconductor package with an elongated and narrow rectangular shape, featuring terminals arranged in two columns with protruding parts that extend outward, allowing for increased lead length while maintaining the minimum distance between pads by optimizing the angle and shape of the protruding parts to ensure secure placement and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the height of the lead ball is increased to increase the amount of lead, then the amount of lead increases, but the vertical length of the semiconductor package increases which is restricted by the decreasing overall height of the camera module
Solution Approach 1:
The invention transitions from increasing lead ball height (vertical dimension) to increasing lead ball diameter (horizontal dimension). This dimensional shift allows the amount of lead to increase while keeping the vertical length of the semiconductor package within acceptable limits for the camera module's overall height constraints.
Solution Approach 2:
The invention changes the critical parameter from lead ball height to lead ball diameter. By optimizing the diameter parameter instead of the height parameter, the amount of lead increases while the vertical dimension remains controlled, resolving the contradiction between lead quantity and package height.
2Quantity of substance
If the diameter of the circular pad is increased to increase the amount of lead, then the amount of lead increases, but the overall height of the camera module increases and the minimum distance between pads cannot be satisfied
Solution Approach 1:
The invention changes the optimization parameter from pad diameter to lead ball diameter. This allows increasing the lead amount through lead ball size rather than pad size, thereby avoiding the issues of increased overall height and reduced minimum distance between pads that would result from enlarging the pad diameter.
3Quantity of substance
If the number of lead balls is increased to increase the amount of lead, then the amount of lead increases, but the minimum distance between pads cannot be satisfied due to limited space
Solution Approach 1:
The invention shifts the strategy from increasing the number of lead balls to increasing the size (diameter) of each lead ball. This parameter change allows achieving the same or greater amount of lead with fewer lead balls, thereby maintaining the minimum distance between pads and avoiding the space constraints that would result from adding more lead balls.
Data Source
AI summary
Disclosed is a wafer-level chip-size package type semiconductor package having a plurality of terminals, wherein the semiconductor package has an elongated rectangular planar shape, the plurality of terminals is configured with two column arranged in the short-side direction of the semiconductor package, and each terminal comprises a circular body part and a protruding part extending outward from the body part.