Camera Module PCB Bending Prevention via Segmentation
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Solution Overview
Problem
Current optical image stabilization (OIS) camera modules experience lens drift and defective image issues due to the bending of printed circuit boards (PCBs) caused by the weight of gyro sensors and posture sensors, leading to erroneous signal detection and reduced performance.
Innovation Solution
Incorporating a strength reinforcement portion and guide rib on the PCB to connect the main and sub-areas, along with a base that accommodates an infrared filter and actuator, to stabilize the PCB and prevent bending, while using a no-screw engagement structure with adhesive material and grooves on the lens to secure components and prevent defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a gyro sensor is mounted on the PCB to detect handshake of the lens for optical image stabilization, then the OIS function is achieved, but the PCB generates bending phenomenon due to weight of the gyro sensor, causing lens drift and defective images
Solution Approach 1:
The PCB is divided into a main area and a sub-area, with the gyro sensor mounted on the sub-area. This segmentation allows the heavy sensor to be positioned away from the main functional area, reducing its impact on overall PCB flatness while maintaining OIS functionality.
Solution Approach 2:
A support structure is introduced locally beneath the gyro sensor on the sub-area to provide targeted reinforcement. This local quality enhancement prevents bending at the sensor location without requiring overall PCB thickening, thus maintaining flatness in the main area where imaging components are located.
2Stability of the object's composition
If the PCB is made thicker to prevent bending, then structural stability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
Instead of uniformly thickening the entire PCB, a support structure is added only in the sub-area where the gyro sensor is mounted. This localized approach provides the necessary structural reinforcement to prevent bending while keeping the main area thickness unchanged, simplifying manufacturing compared to overall thickening.
Solution Approach 2:
A support structure acts as an intermediary element between the PCB substrate and the gyro sensor. This mediator provides the necessary mechanical support to prevent bending without requiring changes to the PCB's overall thickness or structure, maintaining ease of manufacture.
3Reliability
If the gyro sensor is positioned closer to the lens for better stabilization, then OIS performance is improved, but the bending effect on the PCB increases due to the sensor's weight
Solution Approach 1:
The PCB is segmented into main and sub-areas, allowing the gyro sensor to be positioned on the sub-area close to the lens for optimal stabilization performance. The support structure on the sub-area counteracts the bending effect of the sensor's weight, enabling close positioning without sacrificing PCB flatness.
Solution Approach 2:
The support structure serves as an intermediary that enables the gyro sensor to be positioned closer to the lens by providing localized mechanical support. This mediator allows the sensor to operate at the optimal position for stabilization while preventing the bending that would otherwise occur due to its weight.
Data Source
AI summary
The camera module according to the present disclosure can improve reliability by mounting a posture sensor on a PCB and promoting a bending prevention of the PCB.