Vehicle Camera PCB Shielding With Elastic EMI Contact Elements

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Solution Overview

Problem

Existing camera devices for vehicles face challenges in effectively shielding electronic components from electromagnetic interference (EMI) due to the complexity and cost of manufacturing processes, such as those described in US 2003/016519 A1 and WO2021/099443, which use thermo-formable polymers and multiple PCBs.

Innovation Solution

A camera device with a conductive housing and surface-mounted, elastically deformable elements that surround electronic components, providing both local and global EMI shielding, and are easily mounted using SMT, with optional fastening elements acting as additional shields.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a conforming shield enclosure with thermo-formable adhesive polymer is used, then electromagnetic shielding is provided, but manufacturing cost increases

Engineering Contradiction:
Improveelectromagnetic interference shieldingVSAvoidmanufacturing cost
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent replaces expensive thermo-formable adhesive polymers with inexpensive metal foils or conductive materials that can be easily applied and removed. These simple conductive elements provide effective EMI shielding without the high manufacturing costs associated with thermo-formable polymers, directly addressing the contradiction between shielding effectiveness and manufacturing cost.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the material parameters from complex thermo-formable adhesive polymers to simple metal foils or conductive paints. This parameter change maintains the essential EMI shielding function while dramatically reducing manufacturing complexity and cost, resolving the technical contradiction.

Inventive Principle:
Principle #35Parameter changes

2Object-affected harmful factors

If multiple PCBs and complex housing structures are used, then EMI shielding is achieved, but device complexity increases

Engineering Contradiction:
Improveelectromagnetic interference shieldingVSAvoidstructural complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent merges the EMI shielding function with existing simple housing structures or applies conductive materials directly to single PCB surfaces. This consolidation eliminates the need for multiple separate PCBs and complex housing assemblies, reducing device complexity while maintaining shielding effectiveness.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent makes existing housing structures or PCB surfaces multi-functional by applying conductive coatings or attaching metal foils that provide both structural support and EMI shielding. This universal approach eliminates the need for separate dedicated shielding components, reducing overall device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Object-affected harmful factors

If rigid shielding structures are used, then EMI shielding is provided, but adaptability to mechanical tolerances decreases

Engineering Contradiction:
Improveelectromagnetic interference shieldingVSAvoidtolerance compensation
Core Design Contradiction:
Object-affected harmful factorsVSAdaptability or versatility

Solution Approach 1:

The patent employs flexible metal foils, conductive paints, or elastomeric conductive materials that can deform to accommodate mechanical tolerances and surface irregularities. These flexible conductive elements maintain continuous electrical contact and effective EMI shielding despite variations in assembly tolerances, directly resolving the contradiction between rigid shielding and adaptability.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent uses dynamically adaptable conductive materials that can change their shape or compliance level to match the underlying surface. This dynamic adaptability ensures consistent EMI shielding performance across different assembly conditions and tolerance ranges, overcoming the limitations of rigid shielding structures.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces EMI, protects components from both internal and external radiation, simplifies manufacturing, and ensures reliable electrical contact despite mechanical tolerances, while being cost-effective.

Implementation Method 1

compressed elastically between the wall and the printed circuit board

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentEP4360302B1Camera device for a vehicle, vehicle and method for manufacturing a camera device
Publication Date: 2026.02.18 VALEO SCHALTER & SENSOREN GMBH
  • EP4360302B1 patent drawingFigure 1~2
  • EP4360302B1 patent drawingFigure 3~4
  • EP4360302B1 patent drawingFigure 5~7

AI summary

A camera device (3, 3') for a vehicle (1), comprising: a printed circuit board (5, 5') extending in a main plane (15), one or more electronic components (16, 17, 18) mounted on a surface (19) of the printed circuit board (5, 5'), an electrically conductive housing (6, 6') accommodating the printed circuit board (5, 5'), the housing (6, 6') comprising a wall (22, 22') extending perpendicularly to the main plane (15) of the printed circuit board (5, 5') and surrounding the one or more electronic components (16, 17, 18), and electrically conductive elements (23) for shielding the one or more electronic components (16, 17, 18) from electromagnetic interference, wherein the electrically conductive elements (23) are: surface-mounted on the surface (19) of the printed circuit board (5, 5') such that they surround the one or more electronic components (16, 17, 18), and compressed elastically between the wall (22, 22') and the printed circuit board (5, 5').