Vehicular Camera Module PCB Stress Relief for Focus Stability

The patent applies a flexible printed circuit board (FPC) instead of a rigid PCB to connect the imager to the housing. The FPC can bend and deform to accommodate stress from uneven mating surfaces without transmitting this stress to the imager, thus maintaining focus precision while still providing structural connection. This directly resolves the contradiction by using a flexible material that decouples structural strength from stress transmission.

The patent introduces an intermediary flexible circuit board between the rigid housing and the imager assembly. This FPC acts as a mediator that absorbs mechanical stress and prevents it from reaching the imager, thereby protecting the focus precision while maintaining the structural integrity provided by the rigid housing attachment.

The patent segments the imager PCB by introducing stress relieving slots that divide the board into separate regions. These slots allow different parts of the PCB to move independently under stress, preventing warping and maintaining focus stability. The segmentation approach solves the problem by creating controlled flexibility zones without requiring entirely separate components.

The patent applies local quality by creating specific stress relieving slots only in the regions of the PCB most susceptible to warping, while keeping other areas intact. This targeted approach provides focus stability where needed without unnecessarily complicating the entire device structure.