Camera Module PCB Terminal Layout for Crack-Resistant Solder Joints
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Solution Overview
Problem
Existing camera devices face challenges in miniaturization and functionality, particularly in ensuring reliable electrical connections and efficient heat radiation, while maintaining assembly simplicity and cost-effectiveness, especially in subminiature, low-power devices like those used in smartphones.
Innovation Solution
The camera device design includes a first circuit board with a terminal positioned higher than its conductive layers, spaced apart with insulating layers, and a second circuit board disposed in a seating groove, enhancing electrical connection reliability and heat radiation efficiency, while simplifying assembly and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the terminal is positioned on the lowermost conductive layer of the first circuit board, then the assembly process is simplified, but the reliability of electrical connection deteriorates due to solder cracks
Solution Approach 1:
The terminal is repositioned from the lowermost conductive layer to a higher conductive layer, utilizing the vertical dimension of the circuit board structure. This dimensional change allows the terminal to be located at a height where it does not interfere with the soldering process, thereby improving connection reliability while maintaining assembly simplicity.
Solution Approach 2:
The patent introduces an intermediary structure (the higher conductive layer acting as a mediator) between the terminal and the soldering process. This intermediary allows the terminal to be electrically connected without being directly exposed to the soldering environment, preventing solder cracks while maintaining electrical connectivity.
2Reliability
If the terminal is positioned higher than the lowermost conductive layer, then the reliability of electrical connection is improved, but the device complexity increases
Solution Approach 1:
The higher conductive layer serves multiple functions: it provides electrical connection for the terminal, acts as a structural support element, and facilitates the soldering process by positioning the terminal away from the soldering zone. This multi-functionality reduces the need for additional components, thereby limiting the increase in device complexity.
Solution Approach 2:
The patent changes the vertical position parameter of the terminal from the lowermost conductive layer to a higher conductive layer. This parameter change fundamentally alters the relationship between the terminal and the soldering process, improving reliability without requiring complex structural modifications.
3Volume of moving object
If the conductive layers are positioned close together, then the device size is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
The patent segments the conductive layers into distinct horizontal planes at different vertical heights. This segmentation allows for clearer definition of manufacturing zones and simplifies the positioning process, reducing the stringency of manufacturing precision requirements while maintaining compact device dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design increases solder reliability, prevents cracks, reduces device height, improves heat radiation, and simplifies assembly, thereby enhancing the performance and durability of miniaturized camera devices.
Implementation Method 1
the terminal is coupled to the second circuit board via a solder
Implementation Method 2
improving efficiency of radiation of heat generated by a heat generation source of an OIS moving unit
Implementation Method 3
integrated heat radiating members to enhance electrical connection reliability and heat dissipation
Data Source
AI summary
An embodiment comprises: a fixed part; and a moving part that includes a first circuit board, a second circuit board disposed below the first circuit board, and an image sensor, and moves, in a direction perpendicular to an optical axis direction, with respect to the fixed part. The first circuit board includes a plurality of conductive layers and a terminal soldered to the second circuit board, and the terminal is positioned higher than the lowest conductive layer among the plurality of conductive layers of the first circuit board.