Vehicular Camera PCB Stack With Compliant Thermal Interface

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing vehicle vision systems face challenges in accommodating dimension deviations and manufacturing tolerances during camera assembly, leading to complex and costly focus/alignment processes.

Innovation Solution

The use of a pliable material between the imager and connector printed circuit boards allows for flexible assembly, accommodating dimension deviations and simplifying the assembly process by compressing to fit together properly, reducing the need for screws and flex cables.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If rigid mounting methods are used to attach printed circuit boards, then alignment precision is improved, but assembly complexity and cost increase due to need for screws and flex cables

Engineering Contradiction:
Improvealignment precisionVSAvoidassembly complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent changes the mechanical properties of the mounting material from rigid to compliant, allowing the material to deform and accommodate dimensional variations while maintaining electrical connectivity. This eliminates the need for precision alignment features and fasteners.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces a compliant mounting material as an intermediary between the printed circuit boards and housing, which absorbs dimensional deviations and eliminates the need for direct rigid mechanical connections, thereby simplifying assembly.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If compliant material is used between printed circuit boards, then assembly complexity is reduced, but thermal conduction between boards deteriorates

Engineering Contradiction:
Improveassembly complexityVSAvoidthermal conduction
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent uses a composite material that combines the properties of compliance (elasticity) and thermal conduction, allowing it to both simplify assembly by accommodating dimensional variations and maintain effective thermal transfer between stacked printed circuit boards.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent modifies the thermal properties of the compliant material to ensure adequate thermal conduction, transforming it from a simple flexible spacer into a thermally conductive compliant material that addresses both assembly simplicity and thermal management requirements.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If precise alignment features are implemented, then manufacturing precision is improved, but manufacturing cost increases

Engineering Contradiction:
Improvealignment precisionVSAvoidmanufacturing cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent changes the mounting approach from rigid precision-based to compliant tolerance-based, allowing standard manufacturing tolerances to be used without requiring expensive precision alignment features or post-assembly adjustments.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution simplifies the camera assembly process, reduces capital expenditures, and enhances component density while maintaining proper alignment and focus, thereby easing manufacturing complexities and costs.

Implementation Method 1

a first thermally conductive pliable material disposed between the imager printed circuit board and the connector printed circuit board

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11897398B2Vehicular camera with thermally conductive material disposed between and contacting stacked PCBS
Publication Date: 2024.02.13 MAGNA ELECTRONICS INC
  • US11897398B2 patent drawing
  • US11897398B2 patent drawing
  • US11897398B2 patent drawing

AI summary

A vehicular camera includes a lens holder, a first printed circuit board and a second printed circuit board. The first and second printed circuit boards are stacked and overlap one another. Circuitry disposed at the first printed circuit board is electrically connected with circuitry disposed at the second printed circuit board via board-to-board electrical connection. The circuitry disposed at the first printed circuit board includes an imaging sensor at a first side of the first printed circuit board. Thermally conductive material is disposed between the second printed circuit board and a second side of the first printed circuit board. The thermally conductive material is in thermally-conductive contact with the first and second printed circuit boards. The vehicular camera includes a rear housing, which includes an electrical connector portion. The electrical connector portion of the rear housing may include an electrical plug connector.