Monitoring Camera PCB Through-Cut for Thermal Dissipation
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Solution Overview
Problem
Monitoring cameras in motor vehicles face challenges in compact design and thermal dissipation, as the heat emitted by camera components can impair the operation of the optical sensor.
Innovation Solution
The camera design incorporates a first printed circuit board with a through cut, where the electrical connector is arranged to connect simultaneously to both electrical devices, enhancing thermal dissipation through tabs with heat dissipation coatings and maintaining a non-zero distance between printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the camera components are arranged in a compact layout to save space, then the volume is reduced, but the thermal dissipation is impaired and heat accumulates near the optical sensor
Solution Approach 1:
The patent introduces a third dimension by creating a through-cut passage that penetrates the printed circuit board vertically. This allows the electrical connector to pass through the board thickness, establishing a spatial arrangement where the optical sensor, connector, and light source are positioned at different heights (Z-axis) while maintaining close horizontal proximity. This dimensional transition enables thermal separation without increasing the overall camera footprint.
Solution Approach 2:
The printed circuit board is segmented by the through-cut, dividing it into regions that can be independently managed for thermal and electrical purposes. The connector is positioned in this segmented space, allowing it to serve as both an electrical conduit and a thermal management element by physically separating the heat-generating light source from the heat-sensitive optical sensor while maintaining electrical connectivity.
2Productivity
If the electrical connector is positioned close to the optical sensor to reduce connection length, then the connection efficiency is improved, but the heat from the light source affects the optical sensor operation
Solution Approach 1:
The through-cut in the printed circuit board acts as an intermediary structure that enables the electrical connector to simultaneously achieve short connection length and thermal isolation. The connector passes through the board via the cut, positioning it in an intermediate space between the light source and optical sensor, thus mediating both the electrical connection and thermal management functions.
Solution Approach 2:
The patent applies local quality by creating a specific structural feature (the through-cut) at a precise location on the printed circuit board. This localized modification allows the connector to be positioned optimally for both electrical connectivity and thermal separation, without affecting the overall design of the camera system. The heat dissipation coating on specific tabs further exemplifies local quality application.
3Length of moving object
If the printed circuit board is made thinner to reduce camera thickness, then the compactness is improved, but the thermal dissipation path is reduced
Solution Approach 1:
The through-cut transforms the thermal management approach from a two-dimensional planar dissipation to a three-dimensional vertical pathway. By allowing the connector to pass through the board thickness, the design creates a vertical thermal gradient that enables heat to dissipate along the Z-axis, effectively utilizing the board thickness as a thermal conduction path rather than merely reducing it.
Solution Approach 2:
The patent changes the thermal dissipation parameter by introducing heat dissipation coatings on specific tabs of the printed circuit board. This modifies the thermal conductivity and radiation characteristics of localized areas, enhancing heat dissipation efficiency without requiring increased board thickness. The parameter change is applied selectively to tabs near the through-cut where thermal management is most critical.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves thermal dissipation, maintaining the operational effectiveness of the optical sensor while maintaining a compact camera layout suitable for motor vehicle applications.
Implementation Method 1
at least one of said two tabs comprising a heat dissipation coating
Implementation Method 2
the casing comprises an intermediate element arranged between the first and second printed circuit boards, so as to maintain a non-zero distance between said first and second printed circuit boards
Implementation Method 3
the second end element comprises a partition made of a material capable of blocking visible light and allowing infrared light to pass through
Data Source
AI summary
A monitoring camera that includes: an optical sensor; a light source; first and second printed circuit boards, attached to the optical sensor and the light source respectively; a first electrical device, attached to the first printed circuit board and connected to the optical sensor; a second electrical device, attached to the second printed circuit board and connected to the light source; a casing joined to the first and second printed circuit boards; and an electrical connector. The first printed circuit board has a through cut; and the electrical connector is arranged in the cut so as to be connected simultaneously to the first and second electrical devices.