Camera Module Pin-Solder Fixation for Active Alignment Precision
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Solution Overview
Problem
During the active alignment process in camera module manufacturing, the contraction or expansion of resin bonding agents like epoxy can cause defocusing deviations, leading to process defects.
Innovation Solution
A camera module design that includes a fixing pin protruding from the housing and extending in the optical axis direction, which is inserted into a pin insertion hole on the sensor board and fixed using a soldering part, such as thermally cured solder paste or a solder ring, to securely align the lens and image sensor without epoxy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a resin bonding agent (epoxy) is used to fix the lens housing and sensor board, then the components can be bonded together, but the contraction or expansion during curing causes defocusing deviation and process defects
Solution Approach 1:
The patent removes the resin bonding agent (epoxy) from the fixation process entirely. Instead of using chemical bonding agents that cause contraction/expansion, the invention uses a mechanical fixation method with a fixing pin that passes through the sensor board and lens housing, eliminating the source of defocusing deviation while maintaining bonding strength.
Solution Approach 2:
The patent replaces the chemical bonding system (resin bonding agent) with a mechanical fixation system (fixing pin). This substitution eliminates the curing process that causes volume changes, providing stable focal point alignment while maintaining secure bonding between components.
2Strength
If a resin bonding agent is used to fix the lens housing and sensor board, then the components can be bonded together, but the curing process causes time delays and process defects
Solution Approach 1:
The patent eliminates the resin bonding agent and its associated curing process from the manufacturing workflow. The mechanical fixing pin method provides immediate fixation without waiting for chemical curing, thereby removing time delays and improving manufacturing efficiency while maintaining bonding strength.
Solution Approach 2:
The invention skips the curing process entirely by using mechanical fixation. This allows the manufacturing process to proceed without waiting for the resin to cure, significantly reducing cycle time and improving productivity while avoiding process defects associated with curing.
3Measurement precision
If active alignment is performed with resin bonding agent, then the lens can be positioned on the image sensor, but the contraction during curing causes defocusing deviation
Solution Approach 1:
The patent removes the resin bonding agent that causes instability during curing. By using a mechanical fixing pin instead, the system maintains both high alignment precision during active alignment and stable bonding composition without contraction or expansion issues.
Solution Approach 2:
The patent replaces the chemical bonding system with a mechanical fixation system. This substitution ensures that the bonding stability is maintained through mechanical constraint rather than chemical curing, eliminating defocusing deviation while preserving alignment precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise and quick fixation of the lens housing and sensor board during active alignment, preventing defocusing deviations and process defects, while improving manufacturing efficiency.
Implementation Method 1
curing the solder material to fix the fixing pin in the pin insertion hole
Implementation Method 2
The soldering part may include laser beam thermally cured solder paste
Data Source
AI summary
A camera module includes a lens barrel in which at least one lens is disposed; a housing configured to support the lens barrel; a fixing pin that protrudes from the housing and extends in an optical axis direction; a sensor board having first and second surfaces opposite to each other, and a pin insertion hole into which the fixing pin is inserted; and a soldering part, disposed in the pin insertion hole, that protrudes from first and second surfaces of the sensor board, and fixes the fixing pin.