Camera Device Recess Adhesion Overflow Stopper
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Solution Overview
Problem
Existing camera devices face challenges in achieving a strong and stable joint between the optical member holder and the circuit board, which affects the positional accuracy and durability of the image sensor, due to limitations in adhesion techniques.
Innovation Solution
A camera device design that includes a circuit board with a recess exposing a resinous layer for enhanced adhesion, combined with an overflow stopper to prevent adhesive overflow, ensuring a stronger mechanical connection between the holder and the circuit board, thereby maintaining the desired positional relation between the image sensor and the optical member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive agent is applied to solder resist or metallic layer, then joining is achieved, but adhesion strength is insufficient
Solution Approach 1:
The patent applies local quality by creating a recess that exposes the resinous layer only in the specific area where the adhesive agent needs to be applied. The resinous layer has higher adhesiveness than the solder resist or metallic layer, so by locally exposing it at the recess bottom, the adhesive achieves stronger bonding precisely where needed, while other areas maintain their original protective layers.
Solution Approach 2:
The resinous layer acts as an intermediary substance between the adhesive agent and the circuit board. Instead of applying adhesive directly to the solder resist or metallic layer (which provide poor adhesion), the resinous layer mediates the bonding process by providing a surface with higher adhesiveness that the adhesive agent can effectively bond to.
2Quantity of substance
If adhesive agent is applied generously, then coverage is improved, but adhesive overflows and contaminates image sensor
Solution Approach 1:
The patent segments the circuit board surface by creating a recess with defined walls, effectively dividing the surface into a bonding area (inside the recess) and non-bonding areas (outside the recess). This segmentation allows the adhesive agent to be confined within the recess boundaries, ensuring adequate coverage of the bonding area while preventing overflow onto the image sensor or other sensitive components.
Solution Approach 2:
The patent utilizes the vertical dimension by creating a recess with depth, transforming a two-dimensional surface problem into a three-dimensional solution. The recess walls provide vertical containment for the adhesive agent, allowing it to spread adequately in the horizontal plane for proper coverage while the recess depth and overflow stopper prevent it from flowing outward to contaminate surrounding areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides increased adhesion and stability between the circuit board and the holder, ensuring precise positional alignment and improved durability of the camera device by utilizing the higher adhesiveness of the resinous layer and preventing adhesive overflow with the overflow stopper.
Implementation Method 1
The adhesive agent is attached to the resinous layer to which it has a greater degree of adhesiveness than that of the solder resist or the metallic layer
Data Source
AI summary
A camera device includes a holder in which an optical member is retained and a circuit board with an image sensor. The circuit board at least includes a stack of a solder resist, a metallic layer, and a resinous layer. A groove or recess is formed in the circuit board to have a depth extending through thicknesses of the solder resist and the metallic layer to expose a portion of an outer surface of the resinous layer. The holder is attached to the exposed portion of the outer surface of the resinous layer using an adhesive agent. An overflow stopper is formed at least round the recess to stop the adhesive agent from flowing outside the recess during a production process, thereby enhancing the degree of joining of the holder and the circuit board, and ensuring the stability in positional relation between the image sensor and the optical member.