Wafer-Level Camera Reinforcement Structure with Adhesive Dispensing Openings
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Solution Overview
Problem
Wafer-level camera modules lack adequate structural reinforcement, making them susceptible to mechanical stress and misalignment due to inadequate bonding between the camera module and its enclosure, which fails to provide sufficient protection against electro-magnetic interference and mechanical shocks.
Innovation Solution
A reinforcement structure with openings in side sheet elements for adhesive dispensing and direct structural support to the lens cube, ensuring strong bonding to the camera module and printed circuit board, reducing weight while maintaining structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wafer-level camera modules are manufactured with small size using wafer level technology, then manufacturing cost and footprint are reduced, but structural reinforcement and resistance to mechanical stress are insufficient
Solution Approach 1:
The reinforcement structure is divided into multiple functional components: a top sheet element for EMI shielding, side sheet elements for mechanical reinforcement, and short side sheet elements for lens cube support. This segmentation allows each component to perform its specific function optimally while maintaining overall compactness.
Solution Approach 2:
The reinforcement structure combines multiple materials with different properties: conductive materials for EMI shielding, adhesive materials for bonding, and structurally strong materials for mechanical support. This composite approach resolves the contradiction by providing both small size and adequate strength through material optimization.
2Object-affected harmful factors
If traditional metal enclosures are used for EMI protection, then electro-magnetic interference protection is provided, but bonding strength and mechanical shock protection are insufficient
Solution Approach 1:
The patent merges multiple functions into a single integrated reinforcement structure: EMI shielding, mechanical reinforcement, shock protection, and bonding support. This consolidation resolves the contradiction by providing comprehensive protection without requiring separate traditional metal enclosures, thereby improving both EMI protection and bonding strength simultaneously.
Solution Approach 2:
The reinforcement structure serves multiple purposes: it shields against EMI, reinforces mechanical strength, protects against shocks, and provides bonding surfaces. This multi-functionality allows a single component to address both EMI protection and bonding strength requirements, resolving the technical contradiction.
3Strength
If reinforcement structure is added to camera module, then structural integrity and resistance to mechanical stress are improved, but device complexity increases
Solution Approach 1:
Multiple protective and reinforcing functions are merged into a single integrated structure rather than adding separate components. This reduces assembly complexity while maintaining structural integrity, as the reinforcement structure is applied as one unified element rather than multiple separate parts.
Solution Approach 2:
The reinforcement structure uses thin sheet elements that can conform to the camera module geometry. These thin films provide structural reinforcement without adding significant bulk or complexity, resolving the contradiction between improved strength and reduced device complexity.
4Productivity
If openings are added in side sheet elements for adhesive dispensing, then assembly efficiency is improved, but structural completeness is reduced
Solution Approach 1:
The openings are pre-positioned in the side sheet elements during manufacturing, allowing adhesive to be dispensed through these predetermined locations. This preliminary preparation of adhesive paths improves assembly efficiency while the openings are designed to minimize structural impact, resolving the contradiction between productivity and structural completeness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the structural integrity of wafer-level camera modules, preventing mechanical stress-induced misalignment and improving EMI protection by ensuring a strong, consistent bond between the camera module and its enclosure, enhancing reliability and durability.
Implementation Method 1
A reinforcement structure with openings in side sheet elements for adhesive dispensing, allowing strong bonding to the camera module and printed circuit board
Data Source
AI summary
An example reinforcement structure for protecting a wafer-level camera module includes a top sheet element and a side sheet element. The top sheet element is to be disposed over a top surface of the camera module and includes a first opening for allowing light to pass through to the camera module. The side sheet element is coupled to the top sheet element for securing the reinforcement structure to a printed circuit board (PCB). A second opening in the side sheet element is included to allow an adhesive to be dispensed through the second opening to adhere the reinforcement structure to the camera module.