Camera Module Sensing Arrangement with Multiplexer
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Solution Overview
Problem
Existing camera modules lack efficient sensing arrangements to simultaneously measure position and temperature signals from multiple sensors, which is crucial for precise control of autofocus and optical image stabilization mechanisms.
Innovation Solution
A sensing arrangement comprising a position sensor, a temperature sensor, a driver chip, and a multiplexer, where the driver chip is communicably connected to both sensors and the multiplexer selectively connects either sensor to the driver chip, allowing for the measurement of voltage signals indicative of position or temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate driver chips are used for position sensors and temperature sensors, then each sensor type can be independently controlled, but the number of driver chips and input terminals increases, leading to larger device size and higher complexity
Solution Approach 1:
The driver chip is designed with multi-functionality to handle both position sensor signals and temperature sensor signals through a single chip. The chip includes multiple input terminals that can receive different types of sensor signals, and internal circuitry that can process both position feedback signals and temperature feedback signals, thereby eliminating the need for separate driver chips for each sensor type.
Solution Approach 2:
The patent combines the driver circuits for position sensors and temperature sensors into a single integrated driver chip. The input terminals, signal processing circuits, and control logic for both sensor types are merged within one chip structure, reducing the total number of components and simplifying the overall camera module architecture.
2Measurement precision
If multiple dedicated driver chips are used for different sensors, then signal processing is specialized and reliable, but the overall camera module size and component count increase
Solution Approach 1:
The driver chip incorporates universal signal processing capabilities that can accurately handle both position sensor outputs and temperature sensor outputs. The chip includes configurable input terminals and processing circuits that maintain measurement precision for different sensor types while being integrated into a single compact unit.
Solution Approach 2:
Multiple signal processing functions are merged within the driver chip footprint, allowing the camera module to maintain accurate signal processing for both position and temperature sensors without requiring separate dedicated chips, thereby reducing the overall module area.
3Device complexity
If a single driver chip handles both position and temperature sensors, then device size and component count are reduced, but the driver chip must support multiple sensor types simultaneously
Solution Approach 1:
The driver chip is designed with universal input terminals and processing circuits that can accommodate both position sensor signals and temperature sensor signals. The chip includes multiple input terminals with appropriate impedance matching and signal conditioning circuits that can handle the different electrical characteristics of various sensor types.
Solution Approach 2:
The driver chip internally segments different signal processing paths for position and temperature sensors, allowing each sensor type to be processed through dedicated circuit blocks within the same chip. This segmentation maintains sensor compatibility and signal integrity while achieving integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the use of a common set of input terminals for both position and temperature sensing, reducing the size and number of driver chips required, and providing accurate feedback for camera module operations.
Implementation Method 1
The temperature sensor has a temperature-sensitive resistor
Data Source
AI summary
Described herein are sensing arrangements for a camera module that include a position sensor, a temperature sensor, a driver chip, and a multiplexer. The position sensor has a first bias input and a first set of terminals. The temperature sensor has a temperature-sensitive resistor, a second bias input, and a second set of terminals. The driver chip includes a bias output connected to a bias current source and a set of inputs for receiving a voltage signal. The multiplexer is configured to selectively connect the position sensor or the temperature sensor to the driver chip, such that, the bias output is connected to the first or the second bias input, respectively, and the set of inputs is connected to the first or the second set of terminals, respectively, thereby causing the voltage signal received by the set of inputs to indicate a position or a temperature of the camera module, respectively.