Camera Module Sensor Alignment via Circuit Panel Engagement Posts
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Solution Overview
Problem
Existing opto-electronic device assemblies, particularly in compact devices like cellular phones and PDAs, face challenges due to the large size of turrets required for precise optical element positioning and susceptibility to mechanical and chemical damage, leading to high defect rates and increased costs.
Innovation Solution
A camera module design featuring a circuit panel with engagement posts and a sensor unit where the sensor unit includes a semiconductor chip with a transparent cover, ensuring precise mechanical and optical alignment while minimizing overall height, and using conductive materials for electrical interconnection to reduce contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a turret is used to mount optical elements, then precise positioning of optical elements is achieved, but the area occupied by the turret becomes substantially larger than the chip package and chip itself
Solution Approach 1:
The patent merges the turret structure with the circuit panel by directly mounting optical elements onto the circuit panel, eliminating the need for a separate turret component. This integration reduces the overall area while maintaining positioning precision through direct attachment features.
Solution Approach 2:
The circuit panel serves multiple functions: it provides electrical connections, mechanical support, and direct mounting for optical elements. By making the circuit panel multi-functional, the patent eliminates the need for a dedicated turret structure, thereby reducing the occupied area while maintaining optical positioning capabilities.
2Manufacturing precision
If a turret is used to mount optical elements, then precise positioning of optical elements is achieved, but the overall size of the device increases
Solution Approach 1:
By combining the optical element mounting function directly into the circuit panel, the patent eliminates the additional volume that would be required for a separate turret structure, thereby reducing overall device volume while maintaining optical alignment precision.
Solution Approach 2:
The patent optimizes the vertical arrangement of components, positioning optical elements directly above the circuit panel in a compact configuration. This dimensional optimization reduces the horizontal footprint and overall device volume while maintaining precise optical axis alignment through vertical stacking.
3Manufacturing precision
If a bare or unpackaged image-sensing chip is mounted directly to a turret, then good positioning of the chip relative to optical elements is achieved, but the chip becomes susceptible to mechanical damage and chemical attack
Solution Approach 1:
The patent nests the bare chip within a protective enclosure that is integrated with the mounting structure. The enclosure protects the chip from mechanical damage and chemical attack while the nested design maintains compact dimensions and precise positioning through integrated attachment features.
Solution Approach 2:
The patent introduces a protective enclosure as an intermediary between the bare chip and the external environment. This enclosure serves as a mediator that provides mechanical and chemical protection while allowing precise positioning through integrated mounting features that connect the enclosure to the circuit panel.
4Manufacturing precision
If a bare chip is assembled with a turret, then precise positioning is achieved, but particulate contamination occurs leading to high defect rates
Solution Approach 1:
By merging the chip mounting process with the circuit panel assembly process, the patent reduces the number of separate assembly steps that would expose the bare chip to particulate contamination. The integrated approach allows positioning and protection to occur simultaneously, minimizing contamination risk.
Solution Approach 2:
The patent applies preliminary protective measures by enclosing the chip before final assembly operations. This preliminary protection prevents particulate contamination from occurring during subsequent handling and assembly steps, while positioning precision is maintained through pre-aligned mounting features.
Data Source
AI summary
The present invention relates to a camera module. The camera module includes a circuit panel having a top side, a bottom side and transparent region, the circuit panel having conductors. The module further includes sensor unit disposed on the bottom side of the circuit panel, and the sensor unit includes a semiconductor chip having a front surface including an imaging area facing in a forward direction in alignment with the transparent region and an imaging circuit adapted to generate signals representative of an optical image impinging on the imaging area. The module further includes posts protruding from the bottom side of the circuit panel, wherein at least some of the posts being engagement posts having bottom surfaces, and at least some of the bottom surfaces abutting an engagement surface of the sensor unit.