Camera Sensor Mount Reinforcement for Thin PCB Stability
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Solution Overview
Problem
Camera devices face issues with displacement or deformation of the photosensitive element and circuit board due to external forces, affecting image quality, while maintaining a thin profile is a development goal.
Innovation Solution
Incorporating a groove on the circuit board surface surrounding the assembling hole and a reinforcement plate within the groove to enhance structural strength, preventing displacement and deformation without increasing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the photosensitive element is assembled in the hole of the circuit board to reduce overall thickness, then the overall thickness of the camera device is reduced, but displacement or deformation of the circuit board and photosensitive element occurs easily upon external force application
Solution Approach 1:
The patent applies local quality by adding reinforcement plates specifically at the hole region where the photosensitive element is assembled, rather than reinforcing the entire circuit board. This localized reinforcement enhances the structural strength at the critical weak point while maintaining the overall thin profile of the device.
Solution Approach 2:
The reinforcement structure is segmented into multiple components: the circuit board, the photosensitive element, and the reinforcement plate(s). This segmentation allows each component to perform its specific function - the circuit board provides electrical connectivity, the photosensitive element performs sensing, and the reinforcement plate provides localized structural support.
2Length of stationary object
If the photosensitive element is assembled in the hole of the circuit board to reduce overall thickness, then the overall thickness of the camera device is reduced, but displacement or deformation of the circuit board and photosensitive element occurs easily upon external force application
Solution Approach 1:
The reinforcement plates are strategically positioned at the hole region to provide localized support exactly where the photosensitive element is assembled. This ensures that the reliability of image sensing is maintained by preventing displacement and deformation at the critical sensing location, while the rest of the thin circuit board structure remains intact.
3Strength
If a reinforcement plate is added to enhance structural strength, then displacement and deformation are prevented, but the overall thickness of the camera device increases
Solution Approach 1:
The reinforcement plate is designed to be thin and is positioned only at the specific hole region where additional strength is needed. This localized approach provides the necessary structural support to prevent displacement and deformation while minimizing the increase in overall device thickness.
Solution Approach 2:
The reinforcement plate can be positioned on either the front surface or the back surface of the circuit board, or both. This flexibility in dimensional positioning allows the design team to optimize the thickness profile based on other design constraints while maintaining the necessary structural strength.
Data Source
AI summary
A camera device includes a circuit board, a photosensitive element, and a first reinforcement plate. The circuit board has an assembling hole, a first surface, and a second surface opposite to the first surface. The assembling hole penetrates the first surface and the second surface, the assembling hole has an inner annular surface, the first surface has a first groove, and the first groove surrounds a periphery of the assembling hole. The photosensitive element is in the assembling hole, and the photosensitive element has a front surface, a back surface, and an outer peripheral portion. The outer peripheral portion is fixed to the inner annular surface of the assembling hole, and the front surface is nearer to the first surface as compared with the back surface. The first reinforcement plate is disposed in the first groove of the first surface.