Camera Sensor Shift Assembly Heat Dissipation

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Solution Overview

Problem

Existing camera modules with optical image stabilization (OIS) and autofocus (AF) mechanisms face challenges due to a large gap between the image sensor and the enclosure, which limits heat dissipation and restricts the number of video modes supported, while also impacting the camera's form factor.

Innovation Solution

The camera module design incorporates a flexure attached to a base with a thin width, ensuring the base does not extend below the flexure, allowing direct grounding of the image sensor to the enclosure. This configuration reduces the gap between the image sensor and the enclosure, enhancing heat dissipation and improving the camera's functionality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If the base is made thick to provide structural support for the flexure, then the structural stability is improved, but the gap between the image sensor and enclosure increases, reducing heat dissipation efficiency

Engineering Contradiction:
Improvestructural stabilityVSAvoidheat dissipation efficiency
Core Design Contradiction:
Stability of the object's compositionVSTemperature

Solution Approach 1:

The base is divided into two distinct parts: a thin portion that contacts the flexure for structural support, and a thick portion that contacts the enclosure for heat dissipation. This segmentation allows each part to optimize its function independently, resolving the contradiction between structural stability and heat dissipation efficiency.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the base are given different thickness properties - the local area under the flexure is thin to minimize gap, while the local area contacting the enclosure is thick to maximize thermal contact. This local quality differentiation resolves the contradiction by applying appropriate thickness characteristics to specific locations.

Inventive Principle:
Principle #3Local quality

2Temperature

If the base is made thin to reduce the gap between image sensor and enclosure, then heat dissipation is improved, but the structural support capability deteriorates

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidstructural support capability
Core Design Contradiction:
TemperatureVSStability of the object's composition

Solution Approach 1:

The base is segmented into a thin portion for minimizing gap and maximizing heat dissipation, and a thick portion for providing structural support. This segmentation allows the thin region to improve thermal performance while the thick region maintains structural integrity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The base transitions from a uniform two-dimensional structure to a three-dimensional structure with varying thickness. This dimensional change allows the base to simultaneously achieve thin profiles in heat dissipation zones and thick profiles in structural support zones, resolving the contradiction between heat dissipation and structural capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Stability of the object's composition

If the base extends below the flexure to provide support, then the structural stability is improved, but the camera module height increases, impacting form factor

Engineering Contradiction:
Improvestructural stabilityVSAvoidcamera module height
Core Design Contradiction:
Stability of the object's compositionVSLength of stationary object

Solution Approach 1:

The structural support function is extracted from the base extension below the flexure and relocated to the thick portion of the base that contacts the enclosure. This extraction eliminates the need for the base to extend below the flexure, reducing camera module height while maintaining structural stability through the thick contact portion.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The structural support function is copied from the traditional approach of extending the base below the flexure to the innovative approach of using a thick contact portion at the enclosure interface. This functional copying achieves the same structural stability goal through a different spatial arrangement that reduces overall height.

Inventive Principle:
Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The reduced gap between the image sensor and the enclosure improves heat dissipation, enabling the camera to support more video modes, such as 4K120FPS and 8K30FPS, while also reducing the camera module's height by approximately 250-400 microns, enhancing system fit and performance.

Implementation Method 1

The reduced gap between the image sensor and the enclosure improves heat dissipation

Methodology Applied
Scientific EffectHeat dissipation: Conduction (thermal)

Data Source

PatentUS20250106512A1Sensor Shift Assembly for Camera Module
Publication Date: 2025.03.27 APPLE INC
  • US20250106512A1 patent drawing
  • US20250106512A1 patent drawing
  • US20250106512A1 patent drawing

AI summary

A camera is provided. The camera includes an optical assembly having one or more lens defining an optical axis. The camera also includes an image sensor and an enclosure forming an exterior wall of the camera. The camera further includes an actuator assembly to move the image sensor relative to the optical assembly. In addition, the camera includes a base that is a static component of the camera, wherein the base comprises a seat that faces in a direction that is parallel to the optical axis and away from the optical assembly. The camera also includes a flexure that is attached to the seat, that suspends the image sensor from the base, and that allows motion of the image sensor enabled by the actuator assembly. In some cases, the base does not extend between the flexure and the enclosure.