Molded Camera Sensor Assembly With Wire-Protecting Support
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Solution Overview
Problem
The conventional packaging process for camera modules, such as COB (Chip On Board), struggles to reduce the overall size while maintaining imaging quality due to deformation of wires during molding, leading to reduced efficiency and increased defect rates from wire short circuits and altered mounting relationships between the photosensitive element and the circuit board.
Innovation Solution
A molded photosensitive assembly with a supporting member that prevents the upper mold from pressing on wires, maintaining their shape and ensuring proper electrical connection, and a molding process that integrates the supporter with the circuit board to reduce size and improve imaging quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a plastic lens is used in the camera module, then the number of optical components can be reduced, but the lens becomes susceptible to scratches and chemical corrosion
Solution Approach 1:
The patent applies composite materials by forming a protective coating layer on the plastic lens surface. This coating layer combines the advantages of plastic lenses (lightweight, low-cost, design flexibility) with the durability of hard coatings, creating a composite structure that resists scratches and chemical corrosion while maintaining the optical properties of the original lens.
2Manufacturing precision
If a molded photosensitive assembly is used to form the protective coating, then the coating can be precisely formed, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges the protective coating formation process with the lens manufacturing process itself. The molded photosensitive assembly is applied during the lens molding stage, allowing the coating to be formed precisely on the lens surface in one integrated process rather than as a separate post-processing step, thereby reducing overall manufacturing complexity.
Solution Approach 2:
The protective coating is applied in advance during the lens molding process rather than as a subsequent step. The molded photosensitive assembly is positioned and cured while the lens is being formed, ensuring precise coating formation before the lens undergoes any further processing or assembly.
3Reliability
If multiple separate processes are used to form the protective coating, then the coating can be applied, but the manufacturing time and cost increase
Solution Approach 1:
The patent combines multiple manufacturing steps into a single integrated process. The protective coating formation is merged with the lens molding operation, eliminating separate coating application and curing steps. This reduces manufacturing time and cost while ensuring the coating is properly formed on the lens surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the camera module's size, enhances imaging quality, and decreases defect rates by maintaining wire integrity and preventing short circuits, while ensuring accurate mounting relationships between the photosensitive element and the circuit board.
Implementation Method 1
a molded photosensitive assembly is used to form the protective coating layer on the lens, wherein the molded photosensitive assembly is a photosensitive composition that is directly formed on the lens through UV irradiation
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3B
AI summary
A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.