Camera Module Shield Cavity for Grounding Solder Control
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Solution Overview
Problem
The challenge in camera module assembly is controlling the amount of solder between the grounding pad and the shield to prevent damage to other components while maintaining a compact size, as excessive solder can damage components and insufficient soldering may lead to poor grounding.
Innovation Solution
A camera module design featuring a shield with an opening cavity at the corner corresponding to the grounding pad, allowing for controlled solder formation within the cavity to connect the shield with the grounding pad, and accommodating excessive solder to prevent overflow and ensure proper grounding without increasing the module's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the grounding part and grounding pad are soldered together, then proper grounding is achieved, but it is difficult to control the amount of solder leading to either damage to other components or insufficient grounding
Solution Approach 1:
The shield structure incorporates a localized recessed portion at the specific location where soldering occurs. This local structural modification creates a confined space that naturally limits solder flow and accumulation, enabling precise control over solder amount without affecting the overall shielding structure or manufacturing complexity
Solution Approach 2:
The recessed portion acts as an intermediary structure between the grounding pad and the shield body. It serves as a containment chamber that receives and holds the solder, mediating the soldering process to ensure proper grounding while preventing solder from spreading to other components
2Reliability
If excessive solder is used to ensure proper grounding, then grounding reliability improves, but other components and parts may be damaged
Solution Approach 1:
The recessed portion is pre-formed in the shield structure before soldering takes place. This预先 prepared containment space acts as a cushion or buffer that captures any excess solder during the soldering process, preventing solder overflow from reaching and damaging other components while still allowing sufficient solder to flow for reliable grounding
3Object-affected harmful factors
If the space required for soldering is expanded to avoid damage, then component damage is prevented, but the overall size of the camera module increases
Solution Approach 1:
The recessed portion is nested within the existing shield structure, utilizing the available space inside the shield body. This nested design allows the solder containment function to be integrated into the existing structure without requiring additional external space, thus preventing camera module size increase while still providing protection from solder damage
Data Source
AI summary
A camera module is disclosed. The camera module in accordance with the present invention includes: a printed circuit board having a grounding pad formed on one surface thereof; a housing mounted on an upper side of the printed circuit board and including a lens inside thereof; a shield covering the housing in order to shield electromagnetic waves from an outside and having an opening cavity formed therein in correspondence with a location of the grounding pad; and a solder formed in the opening cavity and connecting the shield with the grounding pad.