Camera Shield Wire Bonding for Reliable Grounding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing camera module assembly methods using conductive bonds or tapes for connecting the shield case and bracket can lead to inconsistent ground resistance and adherence issues over time, increasing costs and potentially causing electrical disconnections.
Innovation Solution
A camera device design that incorporates a conductive connection portion, such as a metal wire or wire ribbon, bonded to the shield portion and bracket using a wire bonding method, ensuring a reliable and consistent electrical connection while maintaining cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive bond or conductive tape is used to connect the shield portion and bracket, then electrical connection is achieved, but ground resistance becomes inconsistent and adherence is lost over time
Solution Approach 1:
The patent replaces the mechanical bonding system (conductive bond or conductive tape) with a wire bonding system. The wire is mechanically secured at both ends through bonding to the shield portion and bracket, eliminating the adherence loss issue of conductive bonds/tapes over time while maintaining consistent electrical connection.
Solution Approach 2:
The wire is preliminarily positioned and bonded at both ends to the shield portion and bracket before final assembly. This preliminary bonding action ensures that the electrical connection is established with consistent ground resistance from the outset, preventing the inconsistency that occurs with conductive bonds that degrade over time.
2Reliability
If conductive bond or conductive tape is used for connection, then electrical connection is established, but cost increases
Solution Approach 1:
The patent uses a simple wire as the connection element, which is more cost-effective than conductive bonds or conductive tapes. The wire can be easily manufactured and replaced if needed, providing a cost-effective solution that maintains reliable electrical connection without the higher costs associated with conductive bonding materials.
3Reliability
If conductive bond is used for connection, then electrical connection is achieved, but ground resistance changes depending on bond composition
Solution Approach 1:
The patent changes the fundamental parameter of the connection method from using conductive bonds/tapes with varying compositions to using a wire with consistent material properties. This parameter change ensures that ground resistance remains consistent regardless of compositional variations, as the wire's electrical properties are uniform along its length and at bonding points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution provides a reliable and cost-effective electrical connection between the shield portion and bracket, maintaining consistent resistance and reducing the risk of disconnections, thereby enhancing the reliability and durability of the camera module assembly.
Implementation Method 1
The one end and the other end of the connection portion may be bonded to the shield portion and the bracket by a wire bonding method.
Data Source
AI summary
A camera device includes a shield portion configured to shield a camera module, a bracket configured to accommodate the shield portion, and a connection portion having conductivity, configured to connect an outer surface of the shield portion and an outer surface of the bracket.