Vehicle Camera SMD Pad Gap for Coaxial Gas Release
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Solution Overview
Problem
Conventional vehicle vision systems face challenges with intricate machining and high costs due to the use of shielded coaxial cables, which can lead to electromagnetic interference and displacement of SMD components during soldering processes.
Innovation Solution
A vehicle vision system with a modified SMD pad design that includes a gap in the circumferential solder pad to allow gas release during soldering, preventing displacement and maintaining shielding effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a complete circumferential shielding solder pad is used to ensure electromagnetic shielding, then shielding effectiveness is improved, but gas trapped during soldering causes displacement of coaxial header components
Solution Approach 1:
The circumferential shielding solder pad is segmented by introducing a gap, dividing it into two separate pad sections. This segmentation allows trapped gas to escape during soldering while maintaining electromagnetic shielding through the remaining pad structure, resolving the conflict between complete shielding and gas release.
Solution Approach 2:
The gap is extracted from the continuous circumferential solder pad, creating a deliberate opening. This extracted space serves as a gas escape path during soldering, preventing component displacement while the remaining pad areas maintain shielding functionality.
2Manufacturing precision
If intricate machining operations are used to create precise coaxial connections, then connection precision is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The complex mechanical machining and casting operations are replaced with a simplified PCB solder pad design. The gap-equipped solder pad enables precise coaxial connections through standard PCB soldering processes, eliminating the need for intricate machining while maintaining connection precision.
3Object-affected harmful factors
If a complete circumferential shielding solder pad is used, then electromagnetic shielding is improved, but design flexibility is reduced due to manufacturing constraints
Solution Approach 1:
The segmented solder pad design with a gap provides manufacturing flexibility while maintaining shielding. This design can be easily adapted to different PCB layouts and coaxial connector positions, enhancing design flexibility compared to rigid intricate machining requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances electrical connections between coaxial connectors and PCBs, reducing component displacement and maintaining electromagnetic compatibility, thereby improving design flexibility and reducing costs.
Implementation Method 1
The gap in the shielding solder pad allows for gases that are evaporating out of the solder during the soldering process to escape during the soldering process
Data Source
AI summary
A camera for a vehicle vision system includes a front housing portion, a circuit board, and a rear housing portion having a connector portion for connection of a vehicle coaxial cable. The circuit board includes a first solder pad for soldering a core pin connecting element, and a second solder pad that partially circumscribes the first solder pad for soldering a shielding connecting element. The second solder pad only partially circumscribes the first solder pad so as to have a gap between opposing ends of the second solder pad. The gap is configured to allow for escape of gases that evaporate out of the solder during the soldering process. The core pin connecting element electrically connects between a core pin of the connected coaxial cable and circuitry of the circuit board and the shielding connecting element electrically connects between shielding of the coaxial cable and circuitry of the circuit board.