Diagnostic Camera Substrate for In-Vacuum Chamber Inspection
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Solution Overview
Problem
Existing methods for monitoring the interior of semiconductor manufacturing chambers are inefficient, and the process drift is not effectively addressed, leading to non-uniform wafer outcomes due to chamber interior conditions, which cannot be visually inspected without taking the chamber offline.
Innovation Solution
A diagnostic substrate with integrated image sensors and a light source, compatible with semiconductor wafer handling, is inserted into the chamber to capture images without releasing the vacuum, utilizing a diffuser to minimize reflections and allowing for frequent inspections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If a camera or sensor is installed in the chamber interior, then chamber inspection capability is improved, but the chamber must be taken offline and vacuum released for operation
Solution Approach 1:
The camera substrate is designed to nest within the wafer handling ecosystem of the chamber. It uses the same transfer mechanisms and interfaces as actual wafers, allowing it to be inserted and removed through existing chamber openings without requiring the chamber to be opened or taken offline. This nesting approach enables the camera to occupy the same physical and operational space as process wafers.
Solution Approach 2:
The camera substrate is made self-sufficient by integrating all necessary components directly onto the substrate: image sensors, light sources, diffusers, and control electronics are all incorporated into a single unit. This self-contained design eliminates the need for external support infrastructure, allowing the camera to operate independently within the vacuum environment and be handled by existing automation without requiring additional chamber modifications.
2Loss of information
If the chamber is opened for inspection, then interior conditions can be visually inspected, but significant downtime is produced
Solution Approach 1:
The mechanical action of opening the chamber door for inspection is replaced by a robotic substrate handling system. The camera substrate is inserted and removed using the same automated transfer mechanisms that handle wafers, eliminating the need for manual chamber opening and closing. This substitution transforms a manual, time-consuming operation into an automated, rapid process that maintains vacuum integrity.
Solution Approach 2:
The camera substrate is prepared in advance with all necessary imaging components mounted and configured before insertion into the chamber. The light sources, diffusers, and sensors are pre-assembled and tested, so that upon insertion, the camera is immediately operational. This preliminary preparation eliminates setup time during chamber operations and enables immediate inspection capability.
3Measurement precision
If dedicated sensors are installed in each chamber, then monitoring precision is improved, but device complexity and cost increase
Solution Approach 1:
The camera substrate is designed as a universal platform that can be deployed in any chamber type without modification. The same substrate design, with standardized interfaces and components, serves multiple chamber configurations and inspection requirements. This universality eliminates the need for chamber-specific sensor installations and reduces overall system complexity while maintaining monitoring precision across different chamber types.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Frequent chamber inspections without downtime, extending the time between maintenance, improving wafer uniformity by detecting chamber conditions, and reducing the need for dedicated sensors per chamber.
Implementation Method 1
the diagnostic substrate may further comprise a light source
Implementation Method 2
utilizing a diffuser to minimize reflections
Implementation Method 3
a plurality of image sensors on the baseplate
Data Source
AI summary
Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.