Camera Substrate Assembly Rigid Support Plate Warpage
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Solution Overview
Problem
Existing co-substrate dual-camera modules face challenges in adapting to variations in lens fields of view and camera chip thicknesses due to warpage issues during thermo-compression bonding, leading to poor flatness and alignment efficiency, which affects the spatial frequency response and imaging quality.
Innovation Solution
A camera substrate assembly featuring a rigid support plate laminated with a printed circuit board, where mounting holes on the board are supported by mounting surfaces on the rigid plate, with adjustable heights and structures such as grooves or bosses to accommodate different lens configurations and chip thicknesses, improving flatness and strength, and using a metal support plate for enhanced heat dissipation and flatness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermo-compression bonding of rigid printed circuit board and flexible circuit board is used, then electrical connection is achieved, but warpage occurs and flatness deteriorates
Solution Approach 1:
The substrate is divided into two functional parts: a rigid printed circuit board for electrical connection and a flexible support plate for mechanical support. This segmentation allows each part to perform its specialized function without compromising the other, solving the contradiction between electrical connectivity and flatness maintenance.
Solution Approach 2:
The flexible support plate acts as an intermediary between the rigid printed circuit board and the camera module. It provides mechanical support and maintains flatness while allowing the rigid board to perform electrical functions, mediating between the conflicting requirements of rigidity and flexibility.
2Strength
If rigid printed circuit board is used for substrate, then structural strength is improved, but warpage occurs during bonding process
Solution Approach 1:
The substrate system is segmented into a rigid printed circuit board for strength and electrical functions, and a flexible support plate for maintaining flatness. This division allows the rigid board to provide structural strength without suffering from warpage issues during bonding.
Solution Approach 2:
The invention changes the material parameter of the support structure from rigid to flexible, creating a support plate that can adapt during bonding processes without generating warpage, while the rigid printed circuit board maintains its structural strength.
3Ease of manufacture
If mounting surfaces are at same height, then assembly is simplified, but cannot adapt to different lens fields of view and chip thicknesses
Solution Approach 1:
The mounting surface heights are made adjustable rather than fixed, allowing the support plate to be configured with different height levels to match different lens and chip combinations. This dynamic adjustment capability provides adaptability while maintaining assembly simplicity through a modular approach.
Solution Approach 2:
Different regions of the support plate can have different local qualities, specifically different mounting surface heights tailored to specific camera module requirements. This allows customization for different lens fields of view and chip thicknesses without complicating the overall assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the flatness and strength of the camera module, improving the shooting effect by reducing warpage impact and adapting to various lens and chip configurations, resulting in better spatial frequency response and imaging performance.
Implementation Method 1
using a metal support plate for enhanced heat dissipation and flatness
Data Source
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AI summary
A camera substrate assembly, a camera module, and a terminal device are provided. The camera substrate assembly includes a rigid support plate and a printed circuit board that are laminated, where at least two mounting holes for accommodating camera chips are disposed on the printed circuit board, the rigid support plate has mounting surfaces that face the mounting holes respectively and are configured to support the camera chips, strength of the rigid support plate is greater than strength of the printed circuit board, and flatness of the mounting surfaces is less than a specified threshold. In the embodiment, the mounting holes disposed on the printed circuit board and the mounting surfaces disposed on the rigid support plate are used to support cameras. This avoids impact of warpage on camera mounting when the printed circuit board and a flexible circuit board are laminated, and improves flatness after camera mounting, thereby improving a shooting effect of a camera module.