Camera Module Substrate Assembly With Stacked Coil PCB Layout
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Solution Overview
Problem
Existing camera module coil manufacturing processes face high defect rates and complexity in integrating flexible printed circuit boards (FPCBs) and rigid PCBs for optical image stabilization (OIS) and auto focusing (AF) functions, particularly in bending and connecting multiple FPCBs to camera modules.
Innovation Solution
A substrate assembly featuring a first substrate unit with a Hall sensor and a second substrate unit with a coil pattern formed on its surface, vertically stacked and electrically connected, where the coil pattern is formed around a through-hole to expose the Hall sensor, allowing for easy mounting and reduced manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple FPCBs are bonded to form a substrate assembly, then the coil pattern can be formed on the substrate, but the thickness of the FPCBs increases making it difficult to bend for coupling to camera module corners
Solution Approach 1:
The substrate assembly is divided into a first substrate unit and a second substrate unit, where the coil pattern is formed on the second substrate unit which is coupled to the first substrate unit. This segmentation allows the first substrate unit to remain thin and flexible for bending, while the second substrate unit provides the necessary structural support for the coil pattern.
Solution Approach 2:
The coil pattern is formed on a separate second substrate unit that is vertically stacked and electrically connected to the first substrate unit. This dimensional separation allows the coil structure to exist in a different plane, enabling the first substrate to maintain its flexibility while the coil functionality is preserved in the stacked configuration.
2Adaptability or versatility
If FPCBs and rigid PCBs are connected to implement coil patterns, then OIS and AF functions can be achieved, but the manufacturing process becomes complex requiring connection operations between different substrate types
Solution Approach 1:
The first substrate unit and second substrate unit are coupled together to form an integrated substrate assembly where the coil pattern is formed on the second substrate unit. This merging eliminates the need for separate connection operations between FPCB and rigid PCB, as both functionalities are integrated into a single assembled structure.
Solution Approach 2:
The substrate assembly serves multiple functions: the first substrate unit provides flexible electrical connections and mounting capability, while the second substrate unit provides the coil pattern for electromagnetic actuation. This multi-functional integration achieves both OIS and AF functions within a single unified structure.
3Force
If copper wires are used to manufacture coils, then electromagnetic force can be generated for AF and OIS, but the coil thickness is 35-40 microns resulting in high defect rates
Solution Approach 1:
The traditional mechanical winding of copper wires is replaced by forming a coil pattern directly on the second substrate unit using conductive traces. This substitution eliminates the mechanical winding process and associated defects, while still generating the necessary electromagnetic force through the patterned conductive paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables easy bending of the substrate assembly for camera module mounting, reduces production costs, and simplifies the manufacturing process by using flexible PCBs for the first substrate and rigid PCBs for the second, while maintaining the magnetic flux density equivalent to copper coils.
Implementation Method 1
a manner of correcting the movement of a camera lens using an electromagnetic force generated between a coil and a magnet is generally used
Implementation Method 2
The first substrate unit may be provided with a Hall sensor, and the second substrate unit may be coupled to the first substrate unit so that a Hall sensor is exposed through the through-hole
Data Source
AI summary
A substrate assembly includes: a first substrate unit; and at least one second substrate unit electrically connected to the first substrate unit and having a coil pattern formed thereon, wherein: the first substrate unit is a flexible substrate; the second substrate is a rigid substrate; the second substrate unit has a coil pattern formed on one of the front surface and the rear surface thereof and includes multiple second substrates laminated in the upward/downward direction and electrically connected to each other; the at least one second substrate unit includes multiple second substrate units arranged on the first substrate unit; the second substrate unit has a through-hole vertically formed therethrough; the coil pattern is formed around the through-hole; the first substrate unit includes a Hall sensor; and the second substrate unit is coupled to the first substrate unit such that the Hall sensor is exposed through the through-hole.