Camera Thermal-Conductive Assembly for Circuit Board Stability
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Solution Overview
Problem
Camera lenses and electronic components in camera devices generate heat during operation, leading to deformation of the circuit board and affecting image clarity.
Innovation Solution
A camera device design incorporating a housing with a front and rear cover, a thermal-conductive element, and thermal-conductive assembling elements that transmit heat generated by the circuit board to the rear cover, enhancing heat dissipation and reducing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the camera module and electronic components are operated continuously, then the functionality of the camera device is maintained, but heat is generated causing circuit board deformation and image clarity degradation
Solution Approach 1:
The patent converts the harmful heat generated by the camera module and electronic components into a beneficial cooling mechanism. By integrating a heat dissipation structure that includes a heat sink and cooling fan, the system actively removes the unwanted thermal energy, transforming the problem of heat generation into an opportunity to demonstrate effective thermal management and maintain operational reliability
Solution Approach 2:
The patent introduces a thermal interface material as an intermediary between the circuit board and heat dissipation components. This intermediary substance facilitates efficient heat transfer from the heat-generating components to the heat sink, enabling effective thermal management while maintaining the functional integrity of the camera system
2Productivity
If the circuit board is heated during operation, then the camera module continues to function, but the circuit board deforms affecting image clarity
Solution Approach 1:
The patent segments the thermal management system into distinct functional components: a heat sink for thermal absorption, a cooling fan for active heat removal, and a thermal interface material for heat transfer. This segmentation allows each component to be optimized for its specific function, effectively managing heat to prevent circuit board deformation while maintaining operational continuity
Solution Approach 2:
The patent changes the thermal parameters of the circuit board environment by introducing active cooling mechanisms. By controlling the temperature parameter through the heat dissipation system, the circuit board maintains its dimensional stability and manufacturing precision even during continuous operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves effective heat dissipation, minimizing circuit board deformation and maintaining image clarity by efficiently transmitting heat away from the front cover, thus preventing excessive temperature buildup.
Implementation Method 1
the front thermal-conductive element contacts the heating element. The two thermal-conductive assembling elements are respectively assembled with the two assembling holes of the circuit board, each of the thermal-conductive assembling elements has a first end and a second end opposite to the first end, the first end is in the front space and contacts the front thermal-conductive element, and the second end is in the rear space and contacts the rear cover
Data Source
AI summary
A camera device includes a housing, an image-capturing module, a front thermal-conductive element, and two thermal-conductive assembling elements. The housing includes a rear cover. The image-capturing module includes a circuit board, and the circuit board divides the housing into a front space and a rear space. A heating element is on the front surface, and two assembling holes are respectively at two opposite sides of the circuit board. The front thermal-conductive element is in the front space and contacts the heating element. The two thermal-conductive assembling elements are respectively assembled with the two assembling holes of the circuit board. Each of the thermal-conductive assembling elements has a first end and a second end, the first end is in the front space and contacts the front thermal-conductive element, and the second end is in the rear space and contacts the rear cover.