Camera Unit Elastic Fixing for Thermal Stability

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Solution Overview

Problem

Existing image recognition systems, such as in-car cameras, face accuracy issues due to temperature fluctuations and vibrations causing changes in the relative position of the imaging device and lens, leading to thermal stress and adhesive peeling.

Innovation Solution

A camera unit is designed with an imaging device fixed using a base plate, an elastic material, and a printed circuit board, which absorbs thermal expansion differences and maintains the imaging device's position through the elastic material's reaction force, ensuring accurate imaging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If adhesive bonding is used to fix the imaging device, then the imaging device can be retained in a constant relative position, but the relative position changes due to thermal stress and vibration in temperature fluctuation environments

Engineering Contradiction:

Improverelative position stabilityVSAvoidpositioning accuracy

Core Design Contradiction:

Stability of the object's compositionVSReliability

Solution Approach 1:

The patent changes the physical state of the fixing mechanism from rigid adhesive bonding to elastic deformation. The elastic body undergoes reversible deformation under thermal stress and vibration, maintaining constant imaging device position through elastic recovery, thereby resolving the contradiction between initial positioning stability and long-term reliability under environmental stress.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The elastic body serves as a pre-configured cushioning element that anticipates thermal stress and vibration effects. By incorporating this elastic component beforehand in the fixing structure, the system prepares for environmental stresses, allowing the imaging device to maintain accurate positioning despite temperature fluctuations and vibrations that would otherwise cause adhesive failure.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Ease of manufacture

If rigid fixing structure is used, then manufacturing is simple, but stress concentration occurs under thermal expansion differences

Engineering Contradiction:

Improvefixing structure simplicityVSAvoidstress resistance

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The patent transforms the fixing structure from rigid to elastic by introducing an elastic body. This parameter change allows the structure to remain simple in assembly while gaining the ability to absorb thermal stress through elastic deformation, thus maintaining both ease of manufacture and stress resistance.

Inventive Principle:

Principle #35Parameter changes

3Stability of the object's composition

If adhesive bonding is used, then the imaging device can be fixed, but adhesive peeling occurs due to deterioration over time

Engineering Contradiction:

Improvefixing stabilityVSAvoidadhesive durability

Core Design Contradiction:

Stability of the object's compositionVSDuration of action of stationary object

Solution Approach 1:

The patent replaces the chemical bonding mechanism of adhesive with a mechanical elastic bonding mechanism. The elastic body provides continuous mechanical pressure and reversible deformation capability, eliminating the adhesive deterioration problem while maintaining fixing stability throughout the product lifecycle.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration maintains the imaging device's position accurately even in environments with temperature fluctuations and vibrations, reducing stress on the solder and leads, and preventing focus issues by stabilizing the camera unit's structure.

Implementation Method 1

an elastic material, and a printed circuit board, wherein the imaging device is constantly pressed against a reference plane within the camera with use of the reaction force of the elastic material

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

thermal stress resulting from a difference in the coefficient of linear expansion between a structural member that abuts on the imaging device and an adhesive

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS8005355B2Camera unit

Publication Date: 2011.08.23 ASTEMO LTD

AI summary

In a camera unit having a lens and an imaging device, the imaging device is fixed by means of a base plate, an elastic material, and a printed circuit board. The imaging device abuts on a first plane of the base plate, and the elastic material is sandwiched between the printed circuit board and a second plane opposite to the first plane of the base plate.