Camera Module Wiring Layout for Bend Crack and Noise Control
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Solution Overview
Problem
Existing camera devices face challenges in miniaturization and performance enhancement, particularly in subminiature, low-power devices, with issues such as wiring cracks, noise interference, and heat dissipation inefficiencies, especially in optical image stabilization and auto-focusing applications.
Innovation Solution
The camera device incorporates a support unit with strategically designed wirings, including wider widths for certain wires near bends and ground wirings to reduce noise interference, and a heat dissipation member to improve thermal management, while minimizing the number of wirings and enhancing design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the width of wirings near bent regions is increased to prevent cracks, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent applies different wiring widths at different locations: wirings near bent regions have larger widths to prevent cracks, while wirings in straight regions maintain standard widths. This local differentiation optimizes reliability where needed without unnecessarily increasing overall device complexity.
2Object-affected harmful factors
If ground wirings are added to shield noise, then noise interference is reduced, but device complexity increases
Solution Approach 1:
Ground wirings are introduced as intermediary elements between signal wirings to shield against noise interference. These ground wirings act as mediators that provide electromagnetic shielding without requiring fundamental changes to the existing wiring architecture.
3Ease of manufacture
If the number of wirings is reduced to improve design flexibility, then ease of manufacture is improved, but reliability may deteriorate
Solution Approach 1:
Multiple wirings are merged into a single integrated support substrate with optimized wiring paths. This consolidation reduces the total number of separate wiring components, improving ease of manufacture and design flexibility while maintaining reliable connections through the integrated structure.
Data Source
AI summary
An Embodiment includes a stationary unit including a second circuit board, a moving unit including a first circuit board disposed on the second circuit board and an image sensor conductively connected to the first circuit board, and a support unit connecting the first circuit board and the second circuit board and configured to support the moving unit so as to be movable in a direction perpendicular to an optical axis direction, wherein the support unit includes an extension member that includes a plurality of wirings conductively connected to the second circuit board, and the support unit includes a bent region, and a width of a first wiring firstly closest to the bent region among the plurality of wirings is larger than a width of a second wiring secondly closest to the bent region among the plurality of wirings.