CAMM Backplate Cutout Layout for PCB Space and Thermal Relief
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Solution Overview
Problem
In compact computer designs, the mounting brackets for components like compression attached memory modules (CAMM) occupy valuable space on the opposite side of the PCB, reducing available placement area and requiring additional space for thermal management.
Innovation Solution
A backplate assembly with a cutout and a plate cap that allows an additional component to be co-located with the CAMM, providing thermal dissipation and structural support while maintaining screw mounting locations, thus freeing up space on the PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mounting bracket is used to secure the CAMM to the PCB, then the CAMM is stably mounted, but the mounting bracket occupies valuable space on the opposite side of the PCB
Solution Approach 1:
The backplate is segmented by introducing a cutout that divides the plate into distinct regions, allowing the CAMM mounting function to be separated from the space occupation function. This enables other components to be positioned in the cutout area while the backplate still provides structural support for the CAMM.
Solution Approach 2:
The invention utilizes the vertical dimension by creating a cutout that extends through the backplate thickness, allowing components to be arranged in different spatial layers. The CAMM is mounted on one side while other components can be positioned in the cutout region, effectively using three-dimensional space rather than just two-dimensional PCB surface area.
2Area of moving object
If both sides of the PCB are used for component placement to maximize placement area, then the motherboard size is minimized, but the mounting bracket for CAMM still reduces available space on the opposite side
Solution Approach 1:
By segmenting the backplate with a cutout, the mounting bracket no longer occupies continuous area on the PCB opposite side. The cutout creates discrete zones that can be independently utilized for different components, thereby increasing the effective placement area on both sides of the PCB.
Solution Approach 2:
The backplate is designed to serve multiple functions: it provides structural support for the CAMM, creates space-saving mounting configuration, and simultaneously enables additional component placement in its cutout region. This multi-functionality maximizes the utilization of available PCB area.
3Reliability
If a mounting bracket is used to avoid stressing the PCB, then the CAMM is securely held, but additional space is required for thermal management
Solution Approach 1:
The backplate with cutout merges the mounting support function with the thermal management function by allowing heat dissipation components to be positioned in the cutout region. This integration eliminates the need for separate thermal management space while maintaining secure CAMM mounting.
Solution Approach 2:
Thermal management components are positioned in the vertical space created by the cutout rather than requiring additional horizontal space on the PCB. This three-dimensional arrangement allows thermal management functionality to be incorporated without increasing the footprint area.
Data Source
AI summary
Disclosed herein is a backplate assembly for mounting a component (such as a compression attached memory module (CAMM)) and a co-located component (such as a solid state drive (SSD)) to a printed circuit board (PCB). The backplate assembly includes a backplate mounted on a first face of the PCB and attached to the component on a second face of the PCB that is opposite to the first face. The backplate includes a cutout to receive the co-located component and a perimeter portion that includes a flange extending away from the backplate and the printed circuit board. The backplate assembly also includes a plate cap configured to engage with the flange to attach the plate cap to the backplate and to at least partially cover the co-located component.