CAMM Retention Bracket and Spring for Alignment and EMI Shielding

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Solution Overview

Problem

Existing retention mechanisms for compression attached memory modules (CAMMs) face challenges such as inadequate torque distribution, misalignment issues, poor electrical connections, and inadequate electromagnetic interference (EMI) shielding, leading to potential damage and suboptimal performance.

Innovation Solution

A retention mechanism using a retention bracket and a retention spring, where the bracket is soldered to the PCB and the spring compresses the CAMM onto the connector, ensuring proper alignment and secure electrical connections while providing EMI shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a retention mechanism is used to compress the CAMM onto the connector, then electrical connections are improved, but misalignment issues and torque distribution problems occur

Engineering Contradiction:
Improveelectrical connectionsVSAvoidalignment
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The retention bracket is divided into multiple segments or sections, each capable of independent adjustment. This segmentation allows the bracket to adapt to slight misalignments while maintaining compression force on the CAMM connector, thereby improving electrical connections without requiring perfect manufacturing precision

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The retention mechanism incorporates adjustable parameters such as spring tension and bracket positioning that can be modified to compensate for alignment variations. By changing these parameters, the system maintains reliable electrical connections even when manufacturing precision varies within acceptable tolerances

Inventive Principle:
Principle #35Parameter changes

2Reliability

If a retention mechanism is used to compress the CAMM onto the connector, then electrical connections are improved, but the structure becomes more complex

Engineering Contradiction:
Improveelectrical connectionsVSAvoidretention mechanism structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The retention bracket integrates multiple functions into a single component: it provides structural support, applies compression force through an integrated spring mechanism, and ensures electrical contact. This merging of functions reduces the number of separate parts needed while maintaining reliable electrical connections

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The retention bracket is designed as a multi-functional component that simultaneously serves as a mounting structure, a compression device, and an alignment guide. This universal design approach improves electrical connections without proportionally increasing device complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Stability of the object's composition

If the retention bracket is soldered to the PCB, then stability is improved, but manufacturing complexity increases

Engineering Contradiction:
Improveretention bracket stabilityVSAvoidassembly process
Core Design Contradiction:
Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The retention bracket is pre-soldered to the PCB during PCB manufacturing before final assembly. This preliminary action ensures stable mechanical and electrical connection of the bracket to the board, while the modular design allows the CAMM module to be installed separately, balancing stability with manufacturing ease

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures reliable electrical connections and improved EMI shielding, addressing alignment and torque distribution issues, thereby enhancing the performance and stability of CAMMs in information handling systems.

Implementation Method 1

The retention spring may retain the CAMM and compress the CAMM onto the CAMM connector and the PCB.

Methodology Applied
Scientific EffectSpring: Spring

Implementation Method 2

The retention spring may retain the CAMM and compress the CAMM onto the CAMM connector and the PCB.

Methodology Applied
Scientific EffectMechanical Force: Mechanical Force

Implementation Method 3

The retention bracket may be soldered by a solder flange to the PCB

Methodology Applied
Scientific EffectSoldering: Soldering

Data Source

PatentUS20260040453A1Screwless retention device for compression attached memory modules
Publication Date: 2026.02.05 DELL PROD LP
  • US20260040453A1 patent drawing
  • US20260040453A1 patent drawing
  • US20260040453A1 patent drawing

AI summary

A retention mechanism is provided to couple a compression attached memory module (CAMM) to a printed circuit board (PCB). The retention mechanism includes a retention bracket and a retention spring. The retention bracket is soldered by a solder flange to the PCB and retains a CAMM connector within the retention bracket. The retention spring retains the CAMM and compresses the CAMM onto the CAMM connector and the PCB.