Can-Free Laser Module for Thin Electronic Device Integration
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Solution Overview
Problem
Conventional projectors with packaged laser modules, such as TO-CAN packages, have a large height due to their internal components, making it difficult to integrate them into thinner electronic devices like smartphones and tablets, limiting design flexibility and precision in image projection.
Innovation Solution
A projector design featuring a laser module without a can packaging, where the laser diode is directly bonded to a submount on a substrate, allowing for a smaller form factor and flexible positioning, combined with a lens module that generates a projected image using a collimated laser beam and diffractive optical elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a packaged laser (TO-CAN package) is used in the projector, then the laser can be easily assembled and manufactured, but the height of the projector increases and cannot be greatly reduced
Solution Approach 1:
The patent removes the protective can packaging from the laser diode assembly, extracting only the essential functional components (laser diode, submount, and mounting structure) while eliminating the height-consuming can structure. This allows the laser module to be integrated directly onto the substrate without the additional height imposed by traditional TO-CAN packaging.
2Reliability
If a packaged laser with can structure is used, then the laser components are protected and easy to handle, but the projector size becomes large and cannot be integrated into thin electronic devices
Solution Approach 1:
The protective can is removed from the traditional laser assembly, and instead, the laser diode is directly mounted on a submount that is integrated onto the substrate. This extraction of the can structure significantly reduces the projector volume while the submount provides adequate mechanical support and electrical connection.
Solution Approach 2:
The patent transitions from a three-dimensional can-structured laser assembly to a planar integration approach where the laser diode is mounted directly on the substrate in a flattened configuration. This dimensional change reduces the vertical profile and overall volume of the projector, enabling integration into thin electronic devices.
3Ease of manufacture
If conventional packaged laser is used, then the assembly process is standardized, but the projector cannot be positioned into thinner electronic devices
Solution Approach 1:
The laser assembly is segmented into discrete components (laser diode, submount, mounting structure) that can be independently positioned and integrated onto the substrate. This segmentation allows for flexible positioning and adaptation to different device thickness requirements while maintaining standardized manufacturing processes for each component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables a compact projector size that can be easily integrated into thin electronic devices, providing precise control over the laser beam and allowing for innovative optical designs, while maintaining the ability to project images and capture depth information for 3D imaging.
Implementation Method 1
a laser diode of the laser module is not packaged within a can
Implementation Method 2
The lens module is arranged for receiving a laser beam from the laser diode of the laser module to generate a projected image
Data Source
AI summary
The present invention provides a projector including a substrate, a laser module and a lens module. The laser module is positioned on the substrate, and a laser diode of the laser module is not packaged within a can. The lens module is arranged for receiving a laser beam from the laser diode of the laser module to generate a projected image of the projector.