Cannulated Implantation Pin with Integrated Heating Element
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Solution Overview
Problem
Conventional implantation pins requiring ultrasonic energy to liquefy mouldable material pose challenges due to the need for substantial pressure and costly ultrasonic sonotrodes, which can be harmful to sensitive tissue and increase surgical costs.
Innovation Solution
A cannulated implantation pin kit using thermal energy from a heating device, such as a heating wire, to melt meltable material within the pin or externally supplied material, allowing for fixation without significant pressure and eliminating the need for ultrasonic sonotrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ultrasonic energy is applied to liquefy mouldable material in conventional implantation pins, then the material can flow into adjacent tissue for fixation, but substantial pressure must be applied which may harm sensitive tissue
Solution Approach 1:
The patent replaces the ultrasonic vibration mechanism with a thermal heating mechanism. Instead of using ultrasonic energy to liquefy the mouldable material, a heating element thermally melts the material, allowing it to flow into the bone tissue without requiring substantial mechanical pressure on the pin. This substitution of mechanical/ultrasonic action with thermal action resolves the contradiction between effective fixation and tissue protection.
2Reliability
If ultrasonic vibrations are used to liquefy mouldable material, then fixation can be achieved, but a complicated and costly ultrasonic sonotrode is required
Solution Approach 1:
The patent substitutes the complex ultrasonic sonotrode system with a simple resistive heating element. The heating element can be directly integrated into the implantation pin, eliminating the need for external ultrasonic generators and sonotrodes. This dramatically simplifies the device while maintaining the ability to liquefy mouldable material for effective fixation.
Solution Approach 2:
The implantation pin becomes self-sufficient by incorporating the heating element directly into its structure. The pin can generate its own heat through resistive heating of the embedded element, eliminating dependence on external ultrasonic equipment. This self-service capability reduces device complexity and surgical procedure complexity.
3Reliability
If ultrasonic energy is used for material liquefaction, then fixation is achieved, but surgical costs increase due to expensive equipment
Solution Approach 1:
The patent employs a disposable implantation pin with an integrated heating element that can be sterilized and used once. This eliminates the need for expensive, reusable ultrasonic equipment and reduces surgical costs. The simple heating element is much cheaper than ultrasonic generators and sonotrodes, making the overall procedure more cost-effective while maintaining fixation reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables implantation without applying significant pressure to sensitive tissue, reduces costs by using a simple heating device, and ensures effective fixation of the pin in the target structure using thermally liquefied material.
Implementation Method 1
The heating device is adapted to be accommodated within at least a portion of the channel of the pin and is furthermore adapted to thermally heat material comprised in the pin and/or the heating device
Implementation Method 2
material of the pin adjacent to the channel is adapted to be thermally melted and the heating device is adapted to thermally heat material of the pin adjacent to the channel in order to melt it
Data Source
AI summary
An implantation pin kit and a method for implanting an implantation pin includes a cannulated implantation pin having a channel and a heating device. The channel of the pin extends in a longitudinal direction of the pin and connects a proximal opening at a proximal end of the pin with a distal opening at a distal end of the pin. The channel of the pin and the heating device are adapted such that the heating device can be accommodated within at least a portion of the channel of the pin. The heating device is adapted to thermally heat material comprised in at least one of the pin and the heating device. Thereby, meltable material of the pin can be liquefied or additional liquefied meltable material can be inserted into the pin and the liquefied material can then be push towards and out of the distal opening in order to augment and fix the implantation pin in a target structure.


