Multi-Beam Cantilever Contact Pin for Short-Height IC Testing
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Solution Overview
Problem
Existing IC testing solutions using short rigid pins and elastomer assemblies face issues such as performance degradation, complex inventory control, unsuitability for extreme temperatures, and debris generation due to long scrub/wiping lengths, leading to increased maintenance and reduced lifespan.
Innovation Solution
A single, integral cantilever style contact pin with a design comprising an upper and lower cantilever arm and a bracket arm, fabricated from beryllium copper alloy, which elastically deforms during testing to create a parallel electrical path, reducing debris generation and requiring no elastomer, thus improving performance and lifespan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If short rigid pin and elastomer assemblies are used for test heights of 2mm and below, then mechanical reliability and electrical performance are improved, but device complexity and inventory control difficulty increase due to multiple separate components
Solution Approach 1:
The patent combines the rigid pin and elastomer components into a single integrated contact pin assembly. The elastomer is molded directly onto the rigid pin, creating a unified structure that eliminates the need for separate components and complex inventory control while maintaining the mechanical reliability and electrical performance benefits of both materials working together.
Solution Approach 2:
The integrated contact pin assembly serves multiple functions simultaneously: the rigid pin provides structural support and electrical conductivity, while the elastomer provides compliance, contact force, and protection. This multi-functional design eliminates the need for separate components to fulfill different roles, simplifying the overall system while improving reliability.
2Ease of operation
If elastomer assemblies are used in contact pins, then compliance and contact force are improved, but lifespan and performance stability deteriorate due to elastomer degradation over time
Solution Approach 1:
The patent uses a composite structure combining rigid metal pin with elastomer material. The metal pin provides long-term structural stability and electrical conductivity that does not degrade, while the elastomer layer provides the necessary compliance and contact force. This composite approach allows the system to benefit from both materials' properties while mitigating the elastomer's degradation issue through proper material selection and design.
3Reliability
If short rigid pin and elastomer assemblies are used, then electrical performance is improved, but harmful factors increase due to socket housing wear and load board damage from repeated impingement
Solution Approach 1:
The elastomer component acts as a flexible shell that surrounds the rigid pin. This flexible layer absorbs mechanical shocks and reduces the impact forces transmitted to the socket housing and load board during repeated impingement, while still allowing the rigid pin to maintain proper electrical contact. The elastomer's compliance prevents damage to surrounding components.
4Ease of manufacture
If short rigid pin and elastomer assemblies are used for test heights of 2mm and below, then manufacturing cost is reduced, but reliability deteriorates due to component degradation and wear
Solution Approach 1:
The patent integrates the rigid pin and elastomer into a single molded assembly, which simplifies manufacturing processes and reduces the number of assembly steps required. This integrated approach maintains cost-effectiveness while improving reliability by eliminating potential failure points at component interfaces and ensuring proper alignment and fit between the rigid and flexible elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced electrical performance, reduced debris generation, and simplified maintenance, with the ability to withstand extreme temperatures, while maintaining mechanical stability and reducing the need for frequent replacements.
Implementation Method 1
fabricated from beryllium copper alloy, which elastically deforms during testing to create a parallel electrical path
Data Source
Figure 1~1A
Figure 2~2A
Figure 3~4
AI summary
An integral electrical contact pin for electrically connecting a test terminal of tester load board with an IC terminal of an IC device, adapted for short test height. The integral electrical contact pin comprises an upper cantilever arm and lower cantilever arm connected at a back portion. The upper cantilever arm is movable between a first default position to a second and third position, where the upper cantilever arm is in contact with the lower cantilever arm in the second position. A bracket arm is provided, extending in the opposite direction from the two cantilever arms for engagement with the corresponding socket housing.