Cantilever Probe Structure for Consistent Solder Climbing Height
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Solution Overview
Problem
Conventional cantilever probe cards face issues with inconsistent solder heights, leading to instability in the soldering process due to varying climbing heights of solders on probes.
Innovation Solution
The design incorporates solder receiving probes with a main segment featuring solder receiving holes and inner supporting arms of specific dimensions, allowing precise control of solder climbing height, and includes features like organic insulation layers to prevent solder climbing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cantilever probes are fixed onto the substrate through solders without additional control structures, then the structure is simple, but the solder climbing height varies and soldering stability deteriorates
Solution Approach 1:
The probe structure is segmented into functional zones: the main segment contains solder receiving holes that divide the solder climbing path into controlled sections, while inner supporting arms further subdivide the spaces between holes. This segmentation prevents uncontrolled solder flow and ensures consistent solder heights across all probes.
Solution Approach 2:
Different regions of the probe are given different properties: the main segment has solder receiving holes with specific dimensions at predetermined locations, while inner supporting arms are positioned between adjacent holes. These local structural variations create specific zones that control solder behavior without affecting the entire probe structure uniformly.
2Manufacturing precision
If solders are allowed to climb freely on cantilever probes, then the soldering process is simple, but the climbing heights vary and connection consistency deteriorates
Solution Approach 1:
The probe structure is prepared in advance with solder receiving holes and inner supporting arms positioned at specific locations before the soldering process. These pre-configured structures create predetermined pathways that guide solder flow and ensure consistent climbing heights, eliminating the need for post-soldering adjustments.
Solution Approach 2:
The solder receiving holes and inner supporting arms act as intermediary structures between the solder and the probe body. These intermediaries control the interaction between solder and probe surface, ensuring that solder climbs to consistent heights by providing structured pathways and physical boundaries.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design stabilizes the soldering process by precisely controlling solder height, ensuring consistent and stable connections.
Implementation Method 1
Each of the solder receiving holes is able to receive the corresponding solder on the soldering end portion, so that the corresponding solder does not climb across the solder receiving holes arranged in one row along the predetermined direction
Data Source
AI summary
A solder receiving probe includes an arm segment, a main segment located at one side of the arm segment, and a testing segment connected to another side of the arm segment. The main segment has a soldering end portion and an extending end portion respectively located at two opposite sides thereof along a predetermined direction. The main segment has a plurality of solder receiving holes that are arranged along a top edge of the soldering end portion and that are arranged in one row along an extending direction perpendicular to the predetermined direction. Any two of the solder receiving holes adjacent to each other are provided with one inner supporting arm therebetween. Each of the solder receiving holes can receive a solder, so that the solder does not climb across the solder receiving holes of the one row along the predetermined direction.