Cantilevered Die Ceramic Package for Precision Circuit Isolation
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Solution Overview
Problem
Precision circuits, such as reference voltage supplies, are vulnerable to thermal fluctuations and mechanical stress, which can cause them to fall outside their narrow operational parameters, leading to unacceptable voltage swings.
Innovation Solution
A ceramic package design featuring a cantilevered semiconductor die with a precision circuit suspended over a hermetically sealed cavity, utilizing a common metal for conductive pathways to mitigate thermocouple effects and maximize thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the semiconductor die is rigidly mounted on the ceramic substrate, then mechanical stability is improved, but thermal fluctuations and mechanical stress adversely affect the precision circuit
Solution Approach 1:
The semiconductor die is divided into two functional segments: a first segment that is rigidly coupled to the ceramic substrate for mechanical support and electrical connection, and a second segment that cantilevers over the cavity to house the precision circuit. This segmentation allows the first segment to provide stability while the second segment remains isolated from mechanical stress and thermal fluctuations, resolving the contradiction between mechanical stability and protection from harmful environmental factors.
2Ease of manufacture
If conventional mounting methods are used, then ease of manufacture is improved, but the precision circuit cannot operate within narrow parameters under thermal and mechanical influences
Solution Approach 1:
The ceramic substrate with its hermetically sealed cavity acts as an intermediary structure between the semiconductor die and the external environment. The cavity provides thermal isolation and mechanical stress relief, while the cantilevered configuration of the die over the cavity minimizes heat conduction paths. This intermediary structure enables the precision circuit to operate reliably within narrow parameters while maintaining ease of manufacture through standard ceramic packaging techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively isolates the precision circuit from mechanical and thermal influences, ensuring that the circuit operates within its specified parameters, even under conditions of thermal fluctuations and mechanical stress.
Implementation Method 1
utilizing a common metal for conductive pathways to mitigate thermocouple effects
Implementation Method 2
maximize thermal resistance
Data Source
AI summary
In some examples, a device comprises: a substrate having a cavity, the cavity having a bottom surface; a die pad in the cavity; and a semiconductor die in the cavity and having a first segment coupled to the die pad and a second segment suspended over and facing the bottom surface.