Cap and manufacturing method thereof

The patent combines two different connection methods (sewing and ultrasonic wave processing) into a single integrated process. The sewing provides durable connection while ultrasonic processing creates a flat, thin seam structure. This merging allows both durability and comfort to be achieved simultaneously by leveraging the strengths of each method.

The seam structure becomes a composite of sewn threads and ultrasonic-welded fabric layers. The combination creates a multi-layered construction where the sewing provides tensile strength and the ultrasonic processing creates a compact, thin bond, resulting in a composite seam that is both strong and flat.

The patent makes the seam connection process universal by making it effective for both synthetic and natural fibers. By combining sewing (which works on all materials) with ultrasonic processing (which creates thin seams on synthetics), the method achieves material-agnostic performance. The sewing component ensures compatibility with natural fibers while the ultrasonic component provides the thin seam benefit where applicable.

The connection process is segmented into two distinct functions: sewing provides universal material compatibility and structural strength, while ultrasonic processing provides thin seam formation and additional bonding. This segmentation allows each component to address its specific strength while working together to overcome the limitations of either method alone.