Cap Layer Protects Conducting Pads in Chip Packages
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Solution Overview
Problem
The existing chip packaging process faces reliability and structural stability issues due to the probing process, which damages conducting pads and can lead to defects and bubble formation during subsequent bonding, affecting the quality of the chip packages.
Innovation Solution
A chip package structure that includes a substrate with a conducting pad structure, a dielectric layer with an opening exposing the pad, and a cap layer that fills the opening to support the pad and prevent damage, improving the structural integrity and reducing bubble formation during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a probing process is performed to ensure chip quality, then measurement precision is improved, but the conducting pad structure is damaged and reliability deteriorates
Solution Approach 1:
The cap layer is formed in advance before the bonding process to protect the conducting pad structure. This preliminary protective action prevents damage that would otherwise occur during subsequent probing and bonding operations, allowing quality measurement while preserving pad integrity.
Solution Approach 2:
The cap layer acts as a cushioning structure that absorbs mechanical stress and prevents direct contact between probing/bonding tools and the conducting pad. This beforehand cushioning protects the pad from damage while still allowing necessary measurements and connections.
2Ease of operation
If the dielectric layer has an opening to expose the conducting pad structure, then ease of operation is improved, but bubble formation occurs during bonding and reliability deteriorates
Solution Approach 1:
The cap layer serves as an intermediary structure that fills the opening in the dielectric layer. It allows the conducting pad to remain accessible for electrical connections while preventing direct exposure that would cause bubble formation during bonding, thus mediating between accessibility and bonding quality requirements.
3Ease of operation
If the conducting pad structure is exposed without protection, then ease of operation is improved, but structural stability deteriorates due to damage during subsequent processes
Solution Approach 1:
The cap layer is formed in advance to provide protective coverage over the conducting pad structure. This preliminary action maintains pad accessibility for operations while simultaneously providing structural protection against damage during subsequent processing steps.
Solution Approach 2:
The cap layer functions as a protective thin film structure that covers the conducting pad. This film-like structure provides mechanical protection while maintaining the electrical and operational accessibility of the underlying pad structure.
Data Source
AI summary
An embodiment of the invention provides a chip package which includes a substrate having a first surface and a second surface; a conducting pad structure located on the first surface; a dielectric layer located on the first surface of the substrate and the conducting pad structure, wherein the dielectric layer has an opening exposing a portion of the conducting pad structure; and a cap layer located on the dielectric layer and filled into the opening.