Cap Layer Separation Apparatus for Semiconductor Chip Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional chip packages with sensing functions are prone to contamination and damage during manufacturing, especially when using thin substrates, leading to reduced yield due to the strong bonding force between the substrate and the semiconductor chip, which can cause wire damage during the separation of the cap layer.
Innovation Solution
A separation apparatus comprising a vacuum nozzle head with a suction pad and a hollow vacuum pipe connected to a vacuum pump, along with a cutting mechanism, is used to carefully separate the cap layer from the substrate by applying suction and lift forces, while a cutting tool reduces adhesion force at the interface to prevent wire damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a thin substrate is used to meet size-miniaturization requirements, then the thickness of the substrate is reduced, but the yield is reduced due to the substrate being bent or damaged during the package process
Solution Approach 1:
The substrate is divided into a front substrate (carrying the chip) and a rear substrate (reinforced plate), which are separated after molding. This segmentation allows the front substrate to be thin for miniaturization while the rear substrate provides reinforcement during processing, resolving the contradiction between thin substrate requirement and structural strength need
2Strength
If a reinforced plate (cap layer) is added to prevent substrate bending, then the substrate strength is improved, but the wires on the thin substrate might be easily damaged during the step of separating the reinforce plate from the thin substrate
Solution Approach 1:
Separation grooves are pre-formed at the bonding interface between the cap layer and substrate before the separation process. These grooves serve as predetermined separation paths that guide the separation process, preventing unintended wire damage during cap layer removal while maintaining the structural strength provided by the cap layer
Solution Approach 2:
Separation grooves act as an intermediary structure between the cap layer and substrate, providing a controlled separation path. The grooves reduce the bonding strength at specific locations, allowing the cap layer to be separated without directly stressing the wire bonding areas, thus preventing wire damage
3Reliability
If the bonding force between the thin substrate and the semiconductor chip is very strong, then the connection reliability is improved, but the wires on the thin substrate might be easily damaged during the step of separating the reinforce plate from the thin substrate
Solution Approach 1:
Separation grooves are pre-formed at the bonding interface between the cap layer and substrate before the separation process. These grooves serve as predetermined separation paths that guide the separation process, preventing unintended wire damage during cap layer removal while maintaining the structural strength provided by the cap layer
Solution Approach 2:
The bonding interface has non-uniform properties due to the presence of separation grooves at specific locations. The grooves create localized regions of reduced bonding strength at the separation path while maintaining strong bonding in other areas, allowing selective separation without damaging wires in regions without grooves
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively separates the cap layer from the substrate without damaging the wires, enhancing the yield and reliability of chip packages by minimizing the risk of contamination and damage during the manufacturing process.
Implementation Method 1
The cap layer is pressed against by the bottom surface of the suction pad and sucked by the suction pad of the vacuum nozzle head after the vacuum pump begins to vacuum the air within the hollow vacuum pipe and the through hole
Data Source
AI summary
An embodiment of this invention provides a separation apparatus for separating a stacked article, such as a semiconductor chip package with sensing functions, comprising a substrate and a cap layer formed on the substrate. The separation apparatus comprises a vacuum nozzle head including a suction pad having a top surface and a bottom surface, a through hole penetrating the top surface and the bottom surface of the suction pad, and a hollow vacuum pipe connecting the through hole to a vacuum pump; a stage positing under the vacuum nozzle head and substantially aligning with the suction pad; a control means coupling to the vacuum nozzle head to lift upward or lower down the vacuum nozzle head; and a first cutter comprising a first cutting body and a first knife connecting to the first cutting body. The cap layer is pressed against by the bottom surface of the suction pad and sucked by the suction pad of the vacuum nozzle head after the vacuum pump begins to vacuum the air within the hollow vacuum pipe and the through hole. Then, the first cutter cuts into the interface between the substrate and the cap layer, and the cap lay is separated from the substrate by the suction force of the vacuum nozzle head and the lift force generated by the upward movement of the vacuum nozzle head.