Cap Member Dual-Chamber IC Encapsulation
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Solution Overview
Problem
The challenge in electronic device manufacturing lies in achieving effective encapsulation of IC components while preventing the undesired swelling and leakage of encapsulation materials, particularly in thinner packages, during manufacturing and thermal processing.
Innovation Solution
A cap member with a dual-chamber structure is used, where the encapsulant material fills a central reception chamber surrounding the IC component, leaving the peripheral chamber free from material, reducing the risk of leakage and enhancing robustness by designing the cap member with an outer and inner wall configuration that extends from the substrate to the cap's opening, allowing for a tapered or frusto-conical shape and annular body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulation material is used to seal IC components in thinner packages, then protection and encapsulation are improved, but material swelling and leakage occur during manufacturing and thermal processing
Solution Approach 1:
The cap member is divided into two distinct chambers: a first chamber that receives and encapsulates the IC component, and a second chamber that remains free of encapsulation material. This segmentation prevents material swelling from affecting the overall package structure while maintaining effective encapsulation protection for the sensitive electronic components.
2Reliability
If encapsulation material fills the entire cap chamber, then complete encapsulation is achieved, but material swelling causes leakage and compromises package integrity
Solution Approach 1:
The cap member structure implements local quality by providing different chamber configurations: the first chamber is designed to be filled with encapsulation material for complete encapsulation of IC components, while the second chamber is intentionally left empty to accommodate material swelling without compromising package integrity or causing leakage.
3Volume of moving object
If the package size is reduced to meet smaller and thinner requirements, then device compactness is improved, but the risk of encapsulation material swelling and leakage increases
Solution Approach 1:
The invention addresses the volume constraint by introducing a vertical dimension solution: the cap member is configured with a height greater than its radial dimensions, creating a tall, narrow structure with a first chamber for encapsulation and a second chamber above it that acts as a swelling accommodation space. This dimensional approach allows effective encapsulation in a compact footprint while preventing leakage through thermal processing.
Data Source
AI summary
An electronic integrated circuit (IC) component is mounted to a substrate. A cap member is applied onto the substrate and covers the electronic IC component. The cap member includes an outer wall defining an opening and an inner wall surrounding the electronic IC component. The inner wall extends from a proximal end at the substrate towards a distal end facing the opening in the outer wall to provide a reception chamber for the electronic IC component and a peripheral chamber between the inner wall and the outer wall of the cap member. An encapsulant material is provided in the reception chamber to seal the electronic IC component without being present in the peripheral chamber.