Cap Member Structure for Hermetic Sealing in Miniaturized LEDs
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Solution Overview
Problem
Existing cap members for electronic devices, such as light emitting devices, fail to provide a hermetic seal and often result in devices that are not miniaturized due to structural limitations.
Innovation Solution
A cap member comprising a frame-shaped light shielding member with specific inner lateral surfaces and a light transmissive member, bonded to a substrate, which is manufactured through a process involving etching and anodic bonding to create a through hole, ensuring a hermetic seal and reducing device width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional cap member structure is used, then the device can be assembled, but it fails to provide a hermetic seal
Solution Approach 1:
The inner lateral surfaces of the light shielding member are pre-formed with first and second regions at different heights before bonding. This preliminary shaping allows the sealing surfaces to align perfectly when the cap member is bonded to the substrate, creating a hermetic seal without requiring additional sealing components or complex assembly steps.
Solution Approach 2:
The inner lateral surface is divided into two distinct regions: a first region extending from the upper surface toward the center, and a second region extending from the lower surface toward the center. This segmentation allows each region to be optimized for its specific sealing function, with the metal film selectively disposed on certain regions to enhance sealing performance.
2Ease of manufacture
If the cap member structure is simplified, then manufacturing is easier, but the device cannot be miniaturized
Solution Approach 1:
The solution moves from conventional two-dimensional planar sealing to three-dimensional stepped sealing surfaces. By creating inner lateral surfaces with different heights (first and second regions), the sealing function is achieved in the vertical dimension while reducing the horizontal footprint, enabling device miniaturization without complicating the manufacturing process.
Solution Approach 2:
The metal film is selectively disposed on specific regions of the light shielding member's lower surface, particularly on the second region of the inner lateral surface. This localized application of sealing material provides enhanced sealing performance only where needed, allowing the overall structure to be minimized while maintaining hermetic sealing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cap member provides a hermetic seal and miniaturizes electronic devices by optimizing the inner lateral surface structure, enhancing airtightness and reducing device width.
Implementation Method 1
a metal film disposed on the lower surface of the light shielding member
Implementation Method 2
a light transmissive member bonded to an upper surface side of the light shielding member
Data Source
AI summary
A cap member includes a frame-shaped light shielding member having an upper surface, a lower surface, and an inner lateral surface connecting inner edges of the upper and lower surfaces; a light transmissive member bonded to an upper surface side of the light shielding member and closing an opening of the light shielding member; and a metal film on the lower surface. The inner lateral surface includes: a first region extending from the inner edge of the upper surface toward the center of an upper-surface-side opening, defined by inner edges of the upper surface, when viewed from above, and a second region extending from the inner edge of the lower surface toward the center of a lower-surface-side opening, defined by inner edges of the lower surface, when viewed from below. The metal film does not reach the inner lateral surface of the light shielding member.