Cap Substrate Marking Layer for Acoustic Wave Chip Traceability
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Solution Overview
Problem
Existing acoustic wave devices lack effective traceability mechanisms for small chips, making it difficult to identify and track individual components in radio frequency electronic systems.
Innovation Solution
A cap substrate with an underside marking layer is introduced to allow for alphanumeric markings, enabling traceability of the cap substrate and facilitating identification of individual components in packaged acoustic wave devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If traditional marking methods are used on small acoustic wave chips, then the chip size can be kept small, but traceability and identification of individual components becomes difficult
Solution Approach 1:
The patent applies dimensionality change by moving the marking surface from the top face of the chip to the bottom surface. This allows markings to be placed on an otherwise unused surface area, providing traceability information without increasing the chip's footprint dimensions. The marking layer is disposed on the bottom surface of the cap substrate, utilizing the vertical dimension rather than consuming horizontal space.
2Area of stationary object
If the cap substrate is made smaller to accommodate small chip requirements, then device miniaturization is achieved, but available space for markings is reduced
Solution Approach 1:
The invention resolves this contradiction by utilizing the bottom surface of the cap substrate for markings. This approach extracts marking capacity from the vertical dimension rather than requiring additional horizontal space. The marking layer is disposed on the bottom surface that faces away from the acoustic wave device, effectively using the cap substrate's underside as a dedicated marking area without encroaching on the top surface area needed for device functionality.
3Loss of information
If markings are placed on the top surface of the cap substrate, then identification is possible, but the markings may interfere with the acoustic wave device or other components
Solution Approach 1:
The patent applies inversion by placing markings on the bottom surface of the cap substrate rather than the conventional top surface. This reverses the expected location of markings, positioning them on the opposite side from the acoustic wave device. The marking layer is disposed on the bottom surface that faces away from the device, ensuring that markings do not interfere with device operation, component placement, or acoustic wave propagation while still providing necessary identification and traceability information.
Data Source
AI summary
A packaged acoustic wave component includes a device substrate and an acoustic wave device mounted on the device substrate. A peripheral wall is attached to the device substrate and surrounds the acoustic wave device. A cap substrate is attached to the peripheral wall and spaced above the device substrate. The cap substrate has a marking layer disposed on a bottom surface of the cap substrate that is disposed above and faces the acoustic wave device. The marking layer is configured to receive one or more markings thereon.