Cap Substrate Bonding via Mold Portion
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Solution Overview
Problem
The existing angular velocity detection devices with metal core substrates and caps bonded using adhesives face increased manufacturing costs and potential reliability issues due to adhesive usage.
Innovation Solution
An electronic device design that eliminates adhesive use by employing a mold portion to bond a cap with a substrate, featuring a cap with a recess and flange portion, where the mold portion bypasses the side to bond the cap and substrate, reducing height and manufacturing costs while ensuring hermetic sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is used to bond the cap and substrate, then bonding strength is achieved, but manufacturing cost increases
Solution Approach 1:
The invention extracts and eliminates the adhesive from the bonding system. Instead of using adhesive to bond the cap and substrate, the patent uses a mechanical bonding structure where the mold portion integrates the cap and substrate directly, removing the need for adhesive and thereby reducing manufacturing cost while maintaining bonding strength.
Solution Approach 2:
The invention merges the cap and substrate into a unified structure through the mold portion. The mold portion is formed to simultaneously accommodate the cap and bond it to the substrate, creating an integrated assembly that eliminates separate bonding steps and adhesive materials.
2Reliability
If adhesive is used to bond the cap and substrate, then bonding is achieved, but reliability decreases due to adhesive-related issues
Solution Approach 1:
The invention removes the adhesive layer from the bonding interface between cap and substrate. By using direct mechanical bonding through the mold portion, the patent eliminates reliability issues associated with adhesive aging, contamination, and improper curing, while also simplifying the manufacturing process.
3Ease of manufacture
If mold portion bonds cap and substrate by molding the flange portion, then adhesive is eliminated and cost is reduced, but manufacturing precision must be maintained
Solution Approach 1:
The invention applies local quality by creating a mold region specifically on the flange portion of the cap. This localized molding approach allows the mold portion to bond the cap and substrate at the critical flange area while maintaining precision control in that specific region, enabling cost reduction without compromising overall manufacturing precision.
Data Source
AI summary
An electronic device includes: a substrate; a first electronic component that is mounted on a first surface of the substrate; a cap that accommodates the first electronic component between the cap and the substrate; and a mold portion that bonds the cap and the substrate. The cap includes a base portion having a recess that opens to a substrate side and accommodates the first electronic component, and a flange portion that protrudes from an end portion of the base portion on the substrate side to an outer peripheral side and is in contact with the first surface. The mold portion is provided from a second surface side of the substrate to a first surface side while bypassing a side, and bonds the cap and the substrate by molding the flange portion in a portion on the first surface side.