Cap Adhesion Pattern Venting for Edge-Emitting Light Sources
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor light emitting devices face challenges in managing pressure within the cap structure, which can lead to tilting and contamination due to gas expansion during adhesive curing, and there is a need for improved manufacturing methods that enhance bonding strength and reduce foreign matter entry.
Innovation Solution
The semiconductor light emitting device incorporates an adhesion pattern with a connecting portion that extends laterally through the adhesion pattern to connect the inside and outside of the cap, allowing gas discharge and filled with a second adhesive to prevent foreign matter entry, while the manufacturing method involves applying a first adhesive to the adhesion pattern and a cap, curing to bond, and then filling the connecting portion with a second adhesive for enhanced sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the cap is bonded to the substrate using adhesive, then bonding strength is improved, but gas expansion during curing causes pressure increase leading to tilting and contamination
Solution Approach 1:
The adhesion pattern is divided into a bonded region for strong bonding and a connecting portion for pressure relief. This segmentation allows the adhesive to be applied in distinct functional zones: the bonded region provides strong adhesion between cap and substrate, while the connecting portion acts as a pressure equalization channel that prevents excessive pressure buildup during adhesive curing, thereby preventing tilting and contamination.
Solution Approach 2:
The connecting portion of the adhesion pattern serves as an intermediary structure between the bonded region and the external environment. It mediates the pressure generated during adhesive curing by providing a controlled pathway for gas discharge, thus protecting the cap from excessive internal pressure while maintaining the integrity of the bonded joint.
2Strength
If the adhesion pattern is made continuous for strong bonding, then bonding strength is improved, but foreign matter can enter through the connecting portion
Solution Approach 1:
The connecting portion is designed and positioned in advance during the adhesion pattern fabrication process. This preliminary action ensures that the pressure relief pathway is already in place before adhesive curing begins, allowing controlled gas discharge without creating openings that would permit foreign matter entry during subsequent assembly and operation.
Solution Approach 2:
The connecting portion, which could potentially be seen as a weakness or opening for contamination, is actually converted into a beneficial feature. By designing this controlled pathway, the system transforms the harmful pressure buildup into a manageable process where gas can escape through a predetermined route that does not compromise the overall sealing integrity or allow foreign matter entry.
3Strength
If adhesive is applied generously to ensure complete coverage, then bonding strength is improved, but gas expansion causes excessive pressure increase
Solution Approach 1:
The adhesion pattern is segmented into a bonded region with high adhesive application for strong bonding and a connecting portion with reduced adhesive or no adhesive for pressure relief. This segmentation allows generous adhesive application in the bonded region to ensure complete coverage and strong bonding, while the connecting portion provides a controlled pathway that prevents excessive pressure buildup from the same adhesive volume.
Solution Approach 2:
The connecting portion acts as an intermediary pressure relief valve. It mediates between the large volume of adhesive applied in the bonded region and the confined space inside the cap, allowing the expansion gases to escape through a controlled pathway rather than building up excessive pressure that would cause tilting or contamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively manages pressure within the cap, preventing tilting and contamination, while the manufacturing method ensures strong bonding and efficient production by allowing gas discharge and filling the connecting portion with a second adhesive for enhanced sealing.
Implementation Method 1
a first adhesive 51 bonding the cap 70 to a pattern surface 33S of the adhesion pattern 33
Implementation Method 2
a second adhesive 52 with which the connecting portion 90 is filled
Data Source
AI summary
A semiconductor light emitting device includes a substrate, an edge-emitting light emitting element placed on the substrate, a cap accommodating the edge-emitting light emitting element, an adhesion pattern, a first adhesive, a connecting portion, and a second adhesive. The adhesion pattern is disposed on the substrate so as to surround the edge-emitting light emitting element in plan view. The first adhesive bonds the cap to the pattern surface of the adhesion pattern. The connecting portion laterally extends through at least the adhesion pattern in plan view to connect the inside and the outside of the cap to each other. The connecting portion is filled with the second adhesive.