Capacitance-Based Electrical Connection Defect Detection System
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Solution Overview
Problem
In modern electronic devices with numerous pins, the equivalent capacitance and resistance of the common grounding path in conventional electrical connection defect detection systems lead to inaccurate test results due to undesired capacitance generation, affecting the detection of pin-to-signal line connections.
Innovation Solution
The system separates not-under-test pins into groups with individual grounding paths, preventing equivalent capacitance and resistance effects by ensuring each group connects to ground potential separately, using a signal provider and electrode board to detect capacitance values above a threshold for normal connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a common grounding plane is used for all not-under-test pins, then the grounding structure is simple and easy to implement, but the equivalent capacitance and resistance of the grounding path become very large, leading to inaccurate test results
Solution Approach 1:
The patent divides the grounding structure into multiple separate grounding paths, each corresponding to a specific not-under-test pin group, rather than using a single common grounding plane. This segmentation reduces the equivalent capacitance and resistance of each grounding path, preventing unwanted capacitance coupling between the grounding path and the test signal, thereby improving measurement precision while maintaining reasonable structural complexity.
2Measurement precision
If the electrode board is placed close to the under-test pin, then the detection sensitivity is high, but the equivalent capacitance of the grounding path couples with the test signal, causing inaccurate results
Solution Approach 1:
By segmenting the grounding paths and assigning each not-under-test pin group to its own dedicated grounding path, the patent isolates the capacitance effects to specific paths rather than allowing them to couple with the test signal through a common grounding plane. This enables the electrode board to be positioned for high detection sensitivity without suffering from unwanted capacitance coupling interference.
3Ease of manufacture
If multiple not-under-test pins are connected to ground through a common path, then the grounding implementation is simple, but the equivalent resistance接近the signal line resistance, causing power supply coupling to affect test results
Solution Approach 1:
The patent implements separate grounding paths for different not-under-test pin groups, which reduces the equivalent resistance of each grounding path compared to a common grounding structure. This reduction in resistance minimizes the coupling effect between the power supply and the test signal, thereby improving test result reliability while maintaining reasonable manufacturing ease through systematic grounding path design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the impact of equivalent capacitance and resistance, allowing for accurate detection of electrical connection defects by maintaining a distance between the electrode board and under-test pin, and ensuring that only normal connections meet the capacitance threshold.
Implementation Method 1
the detection module detects a value of a capacitance associated with the electrode board, the under-test pin and the signal line
Data Source
AI summary
An electrical connection defect detection system to detect whether an electrical connection between an under-test pin of an under-test device and a signal line of a circuit board is normal is provided. The electrical connection defect detection system comprises a signal provider providing a test signal to the under-test pin through the signal line, a detection module, an electrode board and a plurality of grounding paths. The electrode board comprises a detection surface to be adapted to a surface of the under-test device opposite to the under-test pin to make the detection module detect a capacitance value associated with the electrode board, the under-test pin and the signal line larger than a threshold value when their connection is normal. The grounding paths are connected to one of not-under-test pin groups respectively to further connect to the ground potential. An electrical connection defect detection method is disclosed herein as well.