Electrostatic Capacitance Input Device Shielding Film
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electrostatic capacitance-type input devices require two flexible wiring substrates, increasing production costs and material costs due to the need for a shielding structure that requires external connection and application of a shield electric potential, complicating the manufacturing process.
Innovation Solution
An electrostatic capacitance-type input device with a translucent input device substrate featuring a position detecting electrode on one face and a shielding film with an extension portion on the opposite face, allowing for a common flexible wiring substrate to be electrically connected to both the position detecting and shield electrodes, thereby simplifying the shielding structure without incurring high costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding structure with a shielding substrate or shield electrode layer is disposed on the side of the input device substrate opposite to the input operation side, then electromagnetic wave noise is blocked, but two flexible wiring substrates are required increasing production cost and material cost
Solution Approach 1:
The patent merges the shielding function and the electrical connection function into a single flexible wiring substrate. The shield electrode layer is formed on the flexible wiring substrate, allowing it to serve both as the shielding structure and as the electrical connection medium between the position detecting electrode and the external circuit. This eliminates the need for a separate flexible wiring substrate for shielding connections.
Solution Approach 2:
The flexible wiring substrate is designed to perform multiple functions simultaneously: it provides electrical connection for the position detecting electrode, provides shielding against electromagnetic wave noise, and serves as the structural component for mounting the position detecting electrode. This multi-functional design reduces the total number of components required in the system.
2Object-affected harmful factors
If a shielding structure is employed, then electromagnetic wave noise is blocked, but the process of connecting the flexible wiring substrate is performed twice increasing production cost
Solution Approach 1:
The patent combines the shielding structure and the electrical connection function into a single integrated component. The flexible wiring substrate with the shield electrode layer formed thereon serves as both the shielding structure and the electrical connection medium, eliminating the need for separate connection processes for shielding and signal transmission.
Solution Approach 2:
The shield electrode layer is formed on the flexible wiring substrate during the manufacturing process, preparing the component in advance for its dual function. This preliminary preparation allows the single flexible wiring substrate to fulfill both shielding and electrical connection roles without requiring additional connection steps during assembly.
3Object-affected harmful factors
If two flexible wiring substrates are used, then shielding and electrical connection are achieved, but material cost increases
Solution Approach 1:
The patent merges the shielding function and the electrical connection function into a single flexible wiring substrate. The shield electrode layer is formed on the flexible wiring substrate, allowing it to serve both as the shielding structure and as the electrical connection medium between the position detecting electrode and the external circuit. This eliminates the need for a separate flexible wiring substrate for shielding connections.
Solution Approach 2:
The flexible wiring substrate is designed to perform multiple functions simultaneously: it provides electrical connection for the position detecting electrode, provides shielding against electromagnetic wave noise, and serves as the structural component for mounting the position detecting electrode. This multi-functional design reduces the total number of components required in the system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively blocks electromagnetic wave noise while reducing production costs by eliminating the need for multiple flexible wiring substrates and simplifying the electrical connections, ensuring reliable and cost-effective manufacturing.
Implementation Method 1
a translucent shielding film that has a shield electrode layer and is disposed so as to overlap with a second face side of the input device substrate
Implementation Method 2
electrostatic capacitance-type input devices monitor electrostatic capacitance that is coupled with each of a plurality of input position detecting electrodes formed on an input device substrate. Thus, when a finger is in proximity to any of the plurality of input position detecting electrodes, the electrostatic capacitance of the input position detecting electrode to which the finger is in proximity increases
Data Source
AI summary
An electrostatic capacitance-type input device includes: a translucent input device substrate that has a translucent position detecting electrode and a position detecting mount terminal electrically connected to the position detecting electrode on a first face side; a flexible wiring substrate that includes an overlapping portion overlapping with the first face side of the input device substrate and is electrically connected to the position detecting mount terminal in the overlapping portion; and a translucent shielding film that has a shield electrode layer and is disposed so as to overlap with a second face side of the input device substrate. The shielding film includes an extension portion that is folded back so as to overlap with the first face side of the input device substrate. The shielding film is electrically connected to the flexible wiring substrate through the extension portion.